HOREXS GROUP
July 3, 2023
FCBGA (Flip Chip Ball Grid Array)
Applications
It is mainly used for CPU/GPU/AI/Aip chip and ASIC semiconductor packaging. BGA substrates connect the chip and the board using solder bump, which allows more wiring and a faster speed than gold wires.
Key features
Flip chip ball grid array (FCBGA) requires applying a multilayer build-up technique from 8 layers or more, forming super-fine circuits less than 10 um, forming solder bumps below 130 um, and manufacturing large-area substrates bigger than 60 x 60 mm.
HOREXS start to develop FCBGA substrate production line is working on the development and mass production with the aim of reaching the technological standards necessary for FCBGA such as CPU/GPU/AiP/AI chip,and automotive MPU, high-speed communication chip, and data center processor.
FCBGA packages electrically connect with solder bumps on the chip, and protect the chip from external factors.
HOREXS’s FCBGA substrates are combining more than 10 years BT substrate manufacturing experience with Tenting and SAP technology, and it provides a basic foundation and electrical connection paths for FCBGA packages.
