Factory Tour

HOREXS GROUP 

Maily production process

TENTING process (35um)-- Improved Tenting (L/S :20/20um ) -- SAP (ABF/BT raw material,L/S:10/10um);

MES+ERP manufacturing system,Smart and fully auto manufacture.

Here is our Tenting Production Process

           Drilling            ⇒         Plating          ⇒         Pattern    ⇒      Exposure    ⇒           Etching         ⇒          AOI&VRS       ⇒   Solder Mask  ⇒  

   Plating Gold    ⇒                ET              ⇒                AVI            ⇒               FQC            ⇒           Cleaning         ⇒           Packging

Horexs as one of the famous IC substrate manufacturers in CHINA,We support 2-6L including buildup for customers,Whatever your product use for.Since our factory built,we also built our R&D team to support our customer technical problem,So,during OEM/ODM,when you want to make your idea be reality,You are welcome contact us for technical supporting of production.

Support:

Wire bonding Substrate

Wire bonding(BGA)

Substrate Embedded (Memor y IC substrate)

MEMS/CMOS,Module(RF,Wireless ,Bluetooth)

2/4/6L (1+2+1/2+2+2/1+4+1),Buildup(Buried/Blind hole)

Flipchip CSP;

Sip package substrate;

Others ultra ic package substrate

Welcome contact us with Gerber and specifications!

Horexs always keep a close eye on the latest development of the industry, and constantly update research and technology innovation strategy, by providing advanced packaging substrate technology solutions, to ensure that companies in the industry's leading technology advantage. "small fine" and "integrated" is including packaging substrate application trend of the development of semiconductor industry chain, thus, in the subsequent few years, the company will focus on the two aspects of research and development and technological innovation.The company's embedded passive component development enables some components to be integrated into the package substrate. The hole size is 40um and below, and the insulation layer is 25um and below, enabling smaller and more compact package solutions.

To protect research and development and innovative technologies, the company has and will continue to apply for patent protection worldwide, including in the United States, China, Japan, South Korea, Taiwan, Israel and European countries.Patent protection includes production processes and product structures that can be implemented by new technologies.The patent strategy not only protects the company from competitors who copy the company's manufacturing process, but also protects the company's product structure by preventing competitors from making products with similar structure by imitating the manufacturing process.

1-MEMS / CMOS(Sesors)

2-MiniLED(Micro LED)

3-Line space/width 35/35um ►Line space/width 20/20um ►Line space/width 10/10um

4-IC substrate Memory(BGA) FCCSP package substrate

5-Sip/BGA/Memory/CSP package substrate

Materials support BT+ABF material(ABF in 2n/3rd Stage of HOREXS Hubei)