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HOREXS is a famous Chinese IC substrate manufacturer which professionally produce 2-6L substrate (buildup types) exceeded 10 years.


Since in 2009,HOREXS already focus on semiconductor packaging substrate manufacturing


Advanced packaging Substrate Manufacturer
( Wire bonding/ Sip/ FCCSP/ Memory/ Module/etc)

our team

R&D teams average age exceeded 30 years,Once was Worked at ASE.

HongRuiXing (Hubei) Electronics Co.,Ltd.
Full intelligent production

Full artomatic processing

Process tracking

Moving times control

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  • BGA Substrate
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company news
china latest news about FCBGA (ABF) Substrate
On July 3, 2023
FCBGA (Flip Chip Ball Grid Array) Applications It is mainly used for CPU/GPU/AI/Aip chip and ASIC semiconductor packaging. BGA substrates connect the chip and the board using solder bump, which allows more wiring and a faster speed than gold wires. Key features Flip chip ball grid array (FCBGA) ...
china latest news about HOREXS will start FCBGA(ABF) R&D in July
On June 27, 2023
In view of the current pattern of domestic semiconductor packaging substrates, as well as HOREXS's own more than ten years of packaging substrate manufacturing experience, upstream and downstream supply chain support, HOREXS company officially entered the research and development and manufacturing ...
china latest news about HOREXS attend Malaysia EMAX-Electronics Manufacturing exhibition
On May 11, 2023
HOREXS will participate in EMAX-Electronics Manufacturing for the first time on 12th July 2023. Expo Asia EMAX 2023 is the only electronic manufacturing and assembly technology and equipment event that brings together international chip manufacturers, semiconductor manufacturers and equipment ...
china latest news about CNY holiday end,2nd factory running
On February 2, 2023
Dear all customers, HOREXS old and new factory now all come back working on 2th Feb.Welcome order the capacity for semiconductor packaging substrate fabrication.HOREXS people always do our best to support you. As the global IC substrate developing very fast past 2020,2021,2022,HOREXS built a second ...
china latest news about Visit & explore HOREXS IC substrate manufacturing plant
On October 31, 2022
Hongruixing (Hubei) Electronics Co., Ltd. (HOREXS Group, HRX), formerly known as Boluo Hongruixing Electronics Co., Ltd., focuses on memory chip packaging substrate business. The packaging substrate has been manufactured for more than 10 years and has a certain position in the domestic memory chip ...