Quality BGA Substrate & IC Package Substrate factory from China

HOREXS attend Malaysia EMAX-Electronics Manufacturing exhibition

On May 11, 2023

HOREXS will participate in EMAX-Electronics Manufacturing for the first time on 12th July 2023. Expo Asia EMAX 2023 is the only electronic manufacturing and assembly technology and equipment event that brings together international chip manufacturers, semiconductor manufacturers and equipment ...

CNY holiday end,2nd factory running

On February 2, 2023

Dear all customers, HOREXS old and new factory now all come back working on 2th Feb.Welcome order the capacity for semiconductor packaging substrate fabrication.HOREXS people always do our best to support you. As the global IC substrate developing very fast past 2020,2021,2022,HOREXS built a second ...

Visit & explore HOREXS IC substrate manufacturing plant

On October 31, 2022

Hongruixing (Hubei) Electronics Co., Ltd. (HOREXS Group, HRX), formerly known as Boluo Hongruixing Electronics Co., Ltd., focuses on memory chip packaging substrate business. The packaging substrate has been manufactured for more than 10 years and has a certain position in the domestic memory chip ...

HOREXS new plant (package substrate) factory was put into production

On September 1, 2022

Recently, it is reported that the first phase of the IC carrier board (also known as packaging substrate) factory built by Hongruixing (Hubei) Electronics Co., Ltd. (hereinafter referred to as "Hongruixing & HOREXS") has been put into trial production recently, and is currently undertaking It has ...

HOREXS facility

On October 13, 2022

IC carrier board, also known as package substrate, is a carrier that connects and transmits signals between a bare chip (DIE) and a printed circuit board (PCB). It can be understood as a high-end PCB product. The function of the IC carrier board is mainly to protect the circuit, fix the circuit and ...

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