logo
  • BGA Substrate
  • Sip Package Substrate
  • FCCSP Package Substrate

Get BGA Substrate & IC Package Substrate Now!

Click Here To Request a Quote

Introduction

HOREXS is a famous Chinese IC substrate manufacturer which professionally produce 2-6L substrate (buildup types) exceeded 10 years.

History

Since in 2009,HOREXS already focus on semiconductor packaging substrate manufacturing

Service

Advanced packaging Substrate Manufacturer
( Wire bonding/ Sip/ FCCSP/ Memory/ Module/etc)

our team

R&D teams average age exceeded 30 years,Once was Worked at ASE.

HongRuiXing (Hubei) Electronics Co.,Ltd.
Full intelligent production

Full artomatic processing

Process tracking

Moving times control

Top Categories

HOREXS GROUP

  • All Categories
  • BGA Substrate
  • IC Package Substrate
  • Sip Package Substrate
  • FCCSP Package Substrate
company news
china latest news about 负责任采购与冲突矿产政策
On April 29, 2026
负责任采购与冲突矿产政策 (含刚果民主共和国及周边地区冲突金属声明) 一、政策背景 本公司承 诺遵守国际公认的负责任矿产采购原则,严格管控来自刚果民主共和国(DRC)及周边受冲突影响地区的金属供应链,杜绝使用为武装冲突提供资金、侵犯人权或造成环境破坏的 “冲突金属”。 根据国际标准及客户要求,本政策管控的金属范围包括但不限于: 传统冲突金属:锡(Sn)、钽(Ta)、钨(W)、金(Au)(3TG) 扩展管控金属:钴(Co)、铜(Cu)、锂(Li)、镍(Ni)、铝(Al)、镁(Mg)及云母等 二、政策承诺 本公司郑重声明: 拒绝冲突金属:不采购、不接受、不使用任何来源可追溯至刚果民主共和国及周边冲...
china latest news about HOREXS helps promote the upgrading of glass substrate industry
On October 30, 2024
In the rapid development of the global semiconductor industry, breakthroughs in technology and materials are the key to promoting industrial progress. As a company specializing in the manufacturing of advanced packaging IC substrates, HOREXS has quickly entered the field of glass substrates with its ...
china latest news about Munich Electronic fair C6-220/9
On September 26, 2024
Welcome to discuss with HOREXS team especially AKEN for the PCB substrate business cooperation in Munich electronics fair on Nov. 2024. HOREXS Booth C6-220/9
china latest news about uHDI PCB knowledge and development
On August 24, 2024
Since Hewlett-Packard created high-density interconnect (HDI) in 1982 to package its first 32-bit computer powered by a single chip, HDI technology has continued to evolve and provide solutions for miniaturized products. The forefront of HDI technology has become the process used by the semiconducto...