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HOREXS GROUP

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  • Sip Package Substrate
  • FCCSP Package Substrate

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Introduction

HOREXS is a famous Chinese IC substrate manufacturer which professionally produce 2-6L substrate (buildup types) exceeded 10 years.

History

Since in 2009,HOREXS already focus on semiconductor packaging substrate manufacturing

Service

Advanced packaging Substrate Manufacturer
( Wire bonding/ Sip/ FCCSP/ Memory/ Module/etc)

our team

R&D teams average age exceeded 30 years,Once was Worked at ASE.

HongRuiXing (Hubei) Electronics Co.,Ltd.
Full intelligent production

Full artomatic processing

Process tracking

Moving times control

Top Categories

HOREXS GROUP

  • All Categories
  • BGA Substrate
  • IC Package Substrate
  • Sip Package Substrate
  • FCCSP Package Substrate
More Products
company news
china latest news about Munich Electronic fair C6-220/9
Munich Electronic fair C6-220/9
On September 26, 2024
Welcome to discuss with HOREXS team especially AKEN for the PCB substrate business cooperation in Munich electronics fair on Nov. 2024. HOREXS Booth C6-220/9
china latest news about uHDI PCB knowledge and development
uHDI PCB knowledge and development
On August 24, 2024
Since Hewlett-Packard created high-density interconnect (HDI) in 1982 to package its first 32-bit computer powered by a single chip, HDI technology has continued to evolve and provide solutions for miniaturized products. The forefront of HDI technology has become the process used by the semiconducto...
china latest news about uHDI PCB capability in HOREXS
uHDI PCB capability in HOREXS
On August 24, 2024
Ultra high-density interconnect (UHDI) is a term used in the electronics industry to describe a cutting-edge technology that pushes the limits of fabrication capabilities for printed circuit boards (PCBs) and semiconductor devices. UHDI represents an advancement in miniaturization and integration, ...
china latest news about HOREXS will attend the Semicon Eurpa 2024
HOREXS will attend the Semicon Eurpa 2024
On July 1, 2024
HOREXS AKEN will attend to the SemiconEuropa 2024 in Munich Germany. Welcome to discuss PCB substrate cooperation with us.To explore with AKEN and see how HOREXS help to reduce your IC substrate cost with our high realiability guarantee. HOREXS PCB Substrate manufacture capability: 1- More than 10 ...
china latest news about FCBGA (ABF) Substrate
FCBGA (ABF) Substrate
On July 3, 2023
FCBGA (Flip Chip Ball Grid Array) Applications It is mainly used for CPU/GPU/AI/Aip chip and ASIC semiconductor packaging. BGA substrates connect the chip and the board using solder bump, which allows more wiring and a faster speed than gold wires. Key features Flip chip ball grid array (FCBGA) ...
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