Quality BGA Substrate & IC Package Substrate factory from China

On February 2, 2023

Dear all customers, HOREXS old and new factory now all come back working on 2th Feb.Welcome order the capacity for semiconductor packaging substrate fabrication.HOREXS people always do our best to support you. As the global IC substrate developing very fast past 2020,2021,2022,HOREXS built a second ...

Visit & explore HOREXS IC substrate manufacturing plant

On October 31, 2022

Hongruixing (Hubei) Electronics Co., Ltd. (HOREXS Group, HRX), formerly known as Boluo Hongruixing Electronics Co., Ltd., focuses on memory chip packaging substrate business. The packaging substrate has been manufactured for more than 10 years and has a certain position in the domestic memory chip ...

HOREXS new plant (package substrate) factory was put into production

On September 1, 2022

Recently, it is reported that the first phase of the IC carrier board (also known as packaging substrate) factory built by Hongruixing (Hubei) Electronics Co., Ltd. (hereinafter referred to as "Hongruixing & HOREXS") has been put into trial production recently, and is currently undertaking It has ...

HOREXS facility

On October 13, 2022

IC carrier board, also known as package substrate, is a carrier that connects and transmits signals between a bare chip (DIE) and a printed circuit board (PCB). It can be understood as a high-end PCB product. The function of the IC carrier board is mainly to protect the circuit, fix the circuit and ...

HOREXS declaration

On September 26, 2022

Dear customers Due to our business development and adjustment, our main business and focus will all transfer to our Hubei center, the “HongruiXing (Hubei) Electronics Co. Ltd.”; All the business will integrate into Hongrui Xing (Hubei) Electronics Co. Ltd.; So from October, please place all the ...

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