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HOREXS GROUP

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  • Sip Package Substrate
  • FCCSP Package Substrate

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Introduction

HOREXS is a famous Chinese IC substrate manufacturer which professionally produce 2-6L substrate (buildup types) exceeded 10 years.

History

Since in 2009,HOREXS already focus on semiconductor packaging substrate manufacturing

Service

Advanced packaging Substrate Manufacturer
( Wire bonding/ Sip/ FCCSP/ Memory/ Module/etc)

our team

R&D teams average age exceeded 30 years,Once was Worked at ASE.

HongRuiXing (Hubei) Electronics Co.,Ltd.
Full intelligent production

Full artomatic processing

Process tracking

Moving times control

Top Categories

HOREXS GROUP

  • All Categories
  • BGA Substrate
  • IC Package Substrate
  • Sip Package Substrate
  • FCCSP Package Substrate
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company news
china latest news about HOREXS helps promote the upgrading of glass substrate industry
HOREXS helps promote the upgrading of glass substrate industry
On October 30, 2024
In the rapid development of the global semiconductor industry, breakthroughs in technology and materials are the key to promoting industrial progress. As a company specializing in the manufacturing of advanced packaging IC substrates, HOREXS has quickly entered the field of glass substrates with its ...
china latest news about Munich Electronic fair C6-220/9
Munich Electronic fair C6-220/9
On September 26, 2024
Welcome to discuss with HOREXS team especially AKEN for the PCB substrate business cooperation in Munich electronics fair on Nov. 2024. HOREXS Booth C6-220/9
china latest news about uHDI PCB knowledge and development
uHDI PCB knowledge and development
On August 24, 2024
Since Hewlett-Packard created high-density interconnect (HDI) in 1982 to package its first 32-bit computer powered by a single chip, HDI technology has continued to evolve and provide solutions for miniaturized products. The forefront of HDI technology has become the process used by the semiconducto...
china latest news about uHDI PCB capability in HOREXS
uHDI PCB capability in HOREXS
On August 24, 2024
Ultra high-density interconnect (UHDI) is a term used in the electronics industry to describe a cutting-edge technology that pushes the limits of fabrication capabilities for printed circuit boards (PCBs) and semiconductor devices. UHDI represents an advancement in miniaturization and integration, ...
china latest news about HOREXS will attend the Semicon Eurpa 2024
HOREXS will attend the Semicon Eurpa 2024
On July 1, 2024
HOREXS AKEN will attend to the SemiconEuropa 2024 in Munich Germany. Welcome to discuss PCB substrate cooperation with us.To explore with AKEN and see how HOREXS help to reduce your IC substrate cost with our high realiability guarantee. HOREXS PCB Substrate manufacture capability: 1- More than 10 ...
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