• BGA Substrate
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  • Sip Package Substrate

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HOREXS is a famous Chinese IC substrate manufacturer which professionally produce 2-6L substrate (buildup types) exceeded 10 years.


Since in 2009,HOREXS already focus on semiconductor packaging substrate manufacturing


Advanced packaging Substrate Manufacturer
( Wire bonding/ Sip/ FCCSP/ Memory/ Module/etc)

our team

R&D teams average age exceeded 30 years,Once was Worked at ASE.

HongRuiXing (Hubei) Electronics Co.,Ltd.
Full intelligent production

Full artomatic processing

Process tracking

Moving times control

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  • BGA Substrate
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  • Sip Package Substrate
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company news
china latest news about Visit & explore HOREXS IC substrate manufacturing plant
On October 31, 2022
Hongruixing (Hubei) Electronics Co., Ltd. (HOREXS Group, HRX), formerly known as Boluo Hongruixing Electronics Co., Ltd., focuses on memory chip packaging substrate business. The packaging substrate has been manufactured for more than 10 years and has a certain position in the domestic memory chip ...
china latest news about HOREXS new plant (package substrate) factory was put into production
On September 1, 2022
Recently, it is reported that the first phase of the IC carrier board (also known as packaging substrate) factory built by Hongruixing (Hubei) Electronics Co., Ltd. (hereinafter referred to as "Hongruixing & HOREXS") has been put into trial production recently, and is currently undertaking It has ...
china latest news about HOREXS facility
On October 13, 2022
IC carrier board, also known as package substrate, is a carrier that connects and transmits signals between a bare chip (DIE) and a printed circuit board (PCB). It can be understood as a high-end PCB product. The function of the IC carrier board is mainly to protect the circuit, fix the circuit and ...
china latest news about HOREXS declaration
On September 26, 2022
Dear customers Due to our business development and adjustment, our main business and focus will all transfer to our Hubei center, the “HongruiXing (Hubei) Electronics Co. Ltd.”; All the business will integrate into Hongrui Xing (Hubei) Electronics Co. Ltd.; So from October, please place all the ...
china latest news about ​IC Substrate Technology Overview
On July 25, 2022
IC Substrate Technology Overview It is called an IC carrier board. A substrate used to package IC bare chips. effect: (1) Carrying semiconductor IC chips. (2) Internal circuits are arranged to conduct the connection between the chip and the circuit board. (3) Protect, fix and support IC chips and ...