Quality BGA Substrate & IC Package Substrate factory from China

On July 3, 2023

FCBGA (Flip Chip Ball Grid Array) Applications It is mainly used for CPU/GPU/AI/Aip chip and ASIC semiconductor packaging. BGA substrates connect the chip and the board using solder bump, which allows more wiring and a faster speed than gold wires. Key features Flip chip ball grid array (FCBGA) ...

HOREXS will start FCBGA(ABF) R&D in July

On June 27, 2023

In view of the current pattern of domestic semiconductor packaging substrates, as well as HOREXS's own more than ten years of packaging substrate manufacturing experience, upstream and downstream supply chain support, HOREXS company officially entered the research and development and manufacturing ...

HOREXS attend Malaysia EMAX-Electronics Manufacturing exhibition

On May 11, 2023

HOREXS will participate in EMAX-Electronics Manufacturing for the first time on 12th July 2023. Expo Asia EMAX 2023 is the only electronic manufacturing and assembly technology and equipment event that brings together international chip manufacturers, semiconductor manufacturers and equipment ...

CNY holiday end,2nd factory running

On February 2, 2023

Dear all customers, HOREXS old and new factory now all come back working on 2th Feb.Welcome order the capacity for semiconductor packaging substrate fabrication.HOREXS people always do our best to support you. As the global IC substrate developing very fast past 2020,2021,2022,HOREXS built a second ...

Visit & explore HOREXS IC substrate manufacturing plant

On October 31, 2022

Hongruixing (Hubei) Electronics Co., Ltd. (HOREXS Group, HRX), formerly known as Boluo Hongruixing Electronics Co., Ltd., focuses on memory chip packaging substrate business. The packaging substrate has been manufactured for more than 10 years and has a certain position in the domestic memory chip ...

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