HOREXS GROUP
| Place of Origin: | china |
|---|---|
| Brand Name: | Horexs |
| Certification: | UL |
| Minimum Order Quantity: | 1 square meter |
| Price: | US 120-150 per square meter |
| Packaging Details: | carton customized |
| Delivery Time: | 7-10 working days |
| Payment Terms: | L/C, D/P, T/T, Western Union, MoneyGram |
| Supply Ability: | 30000 square meters per month |
| Layers: | 4L | Material: | BT |
|---|---|---|---|
| SR: | Taiyo AUS308 | Color: | Black |
| Thickness: | 0.22mm | ||
| High Light: | 0.2mm Immersion Gold Pcb,Horexs Immersion Gold Pcb,Smooth Solder Mask Pcb |
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Description Of IC Substrate pcb
Above IC substrate is a type of carry material for memory integrated circuit with internal circuit to connect the chips and PCBS. Additionally,the IC substrate can protect the circuit, special line, it is designed for heat dissipation and acts standardized module of IC components. It is one of the most key materials of the memory IC packaging, and the share of IC substrate.
| Mini.Line space/width | 35/35um - 20/20um - 10/10um |
| Finished Thk. | 0.22mm |
| Raw material | SHENGYI,Mitsubishi,mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others |
| Surface finished | EING/ ENEPIG/ OSP / Soft gold/ Hard gold etc. |
| Copper thickness | 15um |
| Layer | 2 layer |
| Soldermask/PSR | Green Taiyo brand/ AUS 308 / AUS 320 / AUS 410 / SR-1700,300 series |
HOREXS-Hubei is belong to HOREXS Group, is one of the leading and fast-growing Chinese IC substrate manufacturer.Which was located in Huangshi city of Hubei province China. Factory-Hubei is more than 60000 square meters floor space, which invested more than 300 million USD. IC Substrate Capacity 600,000SQM/Year,Tenting&SAP process. HOREXS-Hubei is committed to the development of IC substrate in China, striving to become one of the top three IC substrate manufacturers in China, and striving to become a world-class IC board manufacturer in the world . Technology like L/S 20/20un,10/10um.BT+ABF materials. Support: Wire bonding Substrate Wire bonding(BGA) Substrate Embedded (Memor y IC substrate) MEMS/CMOS,Module(RF,Wireless ,Bluetooth) 2/4/6L (1+2+1/2+2+2/1+4+1),Buildup(Buried/Blind hole) Flipchip CSP; Others ultra ic package substrate.
HOREXS group has two factories,Old factory located in huizhou city Guangdong,Another one is located in Hubei provice.
HOREXS no set any MOQ / MOV for any clients now.
Yes,We can,Our old factory capacity is 15000sqm/month,New factory is 50000sqm/Month.
Contact person:AKEN,email ID: akenzhang@horexspcb.com,Support roadmap/Design rules files,Production capability files.
No,We dont have it,We are only semiconductor ic substrate manufacture,But we can let our clients to help.
No,From HOREXS roadmap ,HOREXS will start FCBGA substrate manufacture in 2024 or 2025.
Finally,If you are very big customers,Pls also let's know the details of your demand,Horexs also can support your technical supporting if you need!HOREXS 's mission is that help you save cost with same high quality guarantee!