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BGA Substrate

• RF/Wireless/5G IC module substrate manufacture
• microelectronics package substrate manufacture
• 0.2mm Thickness semiconductor assembly substrate microelectronics packaging substrate
• OEM ODM semiconductor packaging substrate China mainland

IC Package Substrate

• Hitachi brand BT material substrate manufacture
• Hitachi BT IC Package Substrate production supporting
• 0.15mm IC assembly package substrate For semiconductor package
• Precision 0.15mm IC Packaging Substrate fabrication

Sip Package Substrate

• Stack Via / Via Filling Sip Package Substrate BT Material 4L Combine Heterogenous System
• Sip package substrate BT material 4 layer ENEPIG

FCCSP Package Substrate

• semiconductor FCCSP Package Substrate manufacture
• 0.3mm FCCSP Package Substrate 4L Buildup Types ENEPIG 5*5mm BT Material
• BT FCCSP Package Substrate 3x3mm Green Color For Flip Chip Assembly
• BT FCCSP Package Substrate 3x3mm Green Color For Flip Chip Assembly

Sensors Substrate

• Semiconductor sensors substrate manufacture
• Fingerprint sensors packaging substrate manufacture supporting
• Sensors package substrate CMOS substrate manufacture supporting

RF Module Substrate

• Camera / Bluetooth / Wireless Module Substrate BT 4L 0.21mm Soft Gold Finished
• RF Module substrate impedance control 4L BT material soft gold

Memory Substrate

• FMC NAND / Flash Memory Substrate BT / FR4 Material 70um For Memory Cards
• 0.15mm Gold Finger SD card substrate manufacture
• FMC substrate manufacture supporting
• Flash memory substrate manufacturer

MEMS Substrate

• 0.2mm Ultrathin MEMS packaging substrate fabrication for microphone&microelectronics
• Horexs Ultra thin MEMS package substrate manufacture supporting
• OEM ODM BT Material MEMS/CMOS Substrate Multilayer substrate manufacture

IoT Substrate

• Camera Module substrate manufacture supporting China
• QFN package sensors substrate manufacture supporting
• BGA/QFN package substrate production for IoT industry semiconductor

Other Ultrathin Substrate

• Flash/NAND memory package substrate production
• Multilayer BT materials semiconductor package substrate manufacture
• BT semiconductor IC packaging substrate manufacture
• CMOS sensors ic package manufacture supporting

Ultrathin Rigid PCB

• SIM Card Smart card pcb manufacture with ultrathin core
• NAND memory substrate ultrathin FR4 core BT raw material
• Ultrathin Rigid PCB manufacture for microelectronics assembly
• FR4 core memory ic substrate manufacture

Medical Equipment PCB

• healthcare electronics/Micro-hearing electronics pcb manufacture