IC substrate, also known as packaging substrate, is an important raw material for integrated circuit packaging, to provide electrical signals for the chip out and support the role of heat dissipation and protection IC substrate is developed from HDI board, according to the packaging mode can be divided into BGA packaging substrate CSP packaging substrate FC packaging substrate MCM packaging substrate The memory packaging substrate invested by HOREXS belongs to IC substrate pcb.
Green Taiyo brand/ AUS 308 / AUS 320 / AUS 410 / SR-1700,300 series
Short introduction of Horexs Manufacturer:
HOREXS-Hubei is belong to HOREXS Group, is one of the leading and fast-growing Chinese IC substrate manufacturer.Which was located in Huangshi city of Hubei province China. Factory-Hubei is more than 60000 square meters floor space, which invested more than 300 million USD. IC Substrate Capacity 600,000SQM/Year,Tenting&SAP process. HOREXS-Hubei is committed to the development of IC substrate in China, striving to become one of the top three IC substrate manufacturers in China, and striving to become a world-class IC board manufacturer in the world . Technology like L/S 20/20un,10/10um.BT+ABF materials. Support: Wire bonding Substrate Wire bonding(BGA) Substrate Embedded (Memor y IC substrate) MEMS/CMOS,Module(RF,Wireless ,Bluetooth) 2/4/6L (1+2+1/2+2+2/1+4+1),Buildup(Buried/Blind hole) Flipchip CSP; Others ultra ic package substrate.
Where's HOREXS company location ?
HOREXS group has two factories,Old factory located in huizhou city Guangdong,Another one is located in Hubei provice.
Does HOREXS have MOQ/ MOV ?
HOREXS no set any MOQ / MOV for any clients now.
Can HOREXS produce big volume ic substrate ?
Yes,We can,Our old factory capacity is 15000sqm/month,New factory is 50000sqm/Month.
What we should contact If we are seeking cooperation with HOREXS ?
Does HOREXS support IC package / IC design service ?
No,We dont have it,We are only semiconductor ic substrate manufacture,But we can let our clients to help.
What does HOREXS need when we need quotation ?
If multilayer pcb substrate,Also need buildup/stackup information;
Others good for quotation files;
Can HOREXS produce FCBGA package substrate now ?
No,From HOREXS roadmap ,HOREXS will start FCBGA substrate manufacture in 2024 or 2025.
Finally,If you are very big customers,Pls also let's know the details of your demand,Horexs also can support your technical supporting if you need!HOREXS 's mission is that help you save cost with same high quality guarantee!
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