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china latest news about HOREXS helps promote the upgrading of glass substrate industry

HOREXS helps promote the upgrading of glass substrate industry

October 30, 2024

In the rapid development of the global semiconductor industry, breakthroughs in technology and materials are the key to promoting industrial progress. As a company specializing in the manufacturing of advanced packaging IC substrates, HOREXS has quickly entered the field of glass substrates with its ...
china latest news about Munich Electronic fair C6-220/9

Munich Electronic fair C6-220/9

September 26, 2024

Welcome to discuss with HOREXS team especially AKEN for the PCB substrate business cooperation in Munich electronics fair on Nov. 2024. HOREXS Booth C6-220/9
china latest news about uHDI PCB knowledge and development

uHDI PCB knowledge and development

August 24, 2024

Since Hewlett-Packard created high-density interconnect (HDI) in 1982 to package its first 32-bit computer powered by a single chip, HDI technology has continued to evolve and provide solutions for miniaturized products. The forefront of HDI technology has become the process used by the semiconducto...
china latest news about uHDI PCB capability in HOREXS

uHDI PCB capability in HOREXS

August 24, 2024

Ultra high-density interconnect (UHDI) is a term used in the electronics industry to describe a cutting-edge technology that pushes the limits of fabrication capabilities for printed circuit boards (PCBs) and semiconductor devices. UHDI represents an advancement in miniaturization and integration, ...
china latest news about HOREXS will attend the Semicon Eurpa 2024

HOREXS will attend the Semicon Eurpa 2024

July 1, 2024

HOREXS AKEN will attend to the SemiconEuropa 2024 in Munich Germany. Welcome to discuss PCB substrate cooperation with us.To explore with AKEN and see how HOREXS help to reduce your IC substrate cost with our high realiability guarantee. HOREXS PCB Substrate manufacture capability: 1- More than 10 ...
china latest news about FCBGA (ABF) Substrate

FCBGA (ABF) Substrate

July 3, 2023

FCBGA (Flip Chip Ball Grid Array) Applications It is mainly used for CPU/GPU/AI/Aip chip and ASIC semiconductor packaging. BGA substrates connect the chip and the board using solder bump, which allows more wiring and a faster speed than gold wires. Key features Flip chip ball grid array (FCBGA) ...
china latest news about HOREXS will start FCBGA(ABF) R&D in July

HOREXS will start FCBGA(ABF) R&D in July

June 27, 2023

In view of the current pattern of domestic semiconductor packaging substrates, as well as HOREXS's own more than ten years of packaging substrate manufacturing experience, upstream and downstream supply chain support, HOREXS company officially entered the research and development and manufacturing ...
china latest news about HOREXS attend Malaysia EMAX-Electronics Manufacturing exhibition

HOREXS attend Malaysia EMAX-Electronics Manufacturing exhibition

May 11, 2023

HOREXS will participate in EMAX-Electronics Manufacturing for the first time on 12th July 2023. Expo Asia EMAX 2023 is the only electronic manufacturing and assembly technology and equipment event that brings together international chip manufacturers, semiconductor manufacturers and equipment ...
china latest news about CNY holiday end,2nd factory running

CNY holiday end,2nd factory running

February 2, 2023

Dear all customers, HOREXS old and new factory now all come back working on 2th Feb.Welcome order the capacity for semiconductor packaging substrate fabrication.HOREXS people always do our best to support you. As the global IC substrate developing very fast past 2020,2021,2022,HOREXS built a second ...
china latest news about Visit & explore HOREXS IC substrate manufacturing plant

Visit & explore HOREXS IC substrate manufacturing plant

October 31, 2022

Hongruixing (Hubei) Electronics Co., Ltd. (HOREXS Group, HRX), formerly known as Boluo Hongruixing Electronics Co., Ltd., focuses on memory chip packaging substrate business. The packaging substrate has been manufactured for more than 10 years and has a certain position in the domestic memory chip ...
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