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June 27, 2023

HOREXS will start FCBGA(ABF) R&D in July

In view of the current pattern of domestic semiconductor packaging substrates, as well as HOREXS's own more than ten years of packaging substrate manufacturing experience, upstream and downstream supply chain support, HOREXS company officially entered the research and development and manufacturing of FCBGA packaging substrates from July, laying the foundation for the realization of SAP process mass production in 2024 2025.


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