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china latest news about ABF material attracts attention again

ABF material attracts attention again

March 11, 2021

HOREXS will introduce more ABF materials to escort the production of IC substrate. The "core shortage" crisis is intensifying, the downtime is full of uncertainty, and the list of global auto companies to stop work and reduce production is constantly expanding. At present, the supply of wafers in ...
china latest news about SMIC obtains permission from the United States to resume supply of 14nm chips; TSMC will begin 3nm chips ； HOREXS enlarge IC substrate capacity

SMIC obtains permission from the United States to resume supply of 14nm chips; TSMC will begin 3nm chips ； HOREXS enlarge IC substrate capacity

March 11, 2021

[SMIC obtains US license: 14nm chips resume supply] Last year, SMIC was blocked, and the purchase of US semiconductor equipment and technology was restricted. Recently, SMIC has received a US license, and 14nm and 28nnm related processes and product lines have resumed supply. Yesterday there was ...
china latest news about Flip Chip Packaging substrate HOREXS

Flip Chip Packaging substrate HOREXS

March 10, 2021

Flip chip derived its name from the method of flipping over the chip to connect with the substrate or leadframe. Unlike conventional interconnection through wire bonding, flip chip uses solder or gold bumps. Therefore, the I/O pads can be distributed all over the surface of the chip and not only on ...
china latest news about Sip package substrate

Sip package substrate

March 10, 2021

System-in-Package (SiP) The drive towards semiconductor miniaturization and integration is rapidly unleashing the power and potential of System-in-Package (SiP), a package or module containing a functional electronic system or sub-system that is integrated and miniaturized through IC assembly ...
china latest news about Packaging Substrate manufacture HOREXS

Packaging Substrate manufacture HOREXS

March 10, 2021

Packaging Substrate Developments in the IC industry have triggered the rapid growth of the computing, communications and consumer electronics market in the last decade. Recently, the outsourcing trend has thrived in semiconductor backend services and the substrate business is a necessary complement ...
china latest news about DRAM substrate market is booming now

DRAM substrate market is booming now

March 11, 2021

Recently, due to the tight production capacity of Samsung, Hynix, and Micron, the DRAM market is in short supply and the DRAM market is the first to enter the upward cycle. However, due to the large number of suppliers, the market competition for NAND Flash is more intense than that of DRAM. Driven ...
china latest news about The Mini-LED market is ready to take off, and the total investment in industrial chain projects exceeds 85 billion yuan

The Mini-LED market is ready to take off, and the total investment in industrial chain projects exceeds 85 billion yuan

January 25, 2021

In the past few years, under the superposition of factors such as lower than expected LED application demand and the rapid release of new capacity, most of the LED industry chain companies have performed poorly. Nowadays, under the continuous deployment of terminal manufacturers, the commercializati...
china latest news about Samsung develops 12-layer TSV package

Samsung develops 12-layer TSV package

August 12, 2020

The technology allows the stacking of 12 DRAM chips using more than 60,000 TSV holes, while maintaining the same thickness as current 8-layer packages. The thickness of the package (720㎛) remains the same as current 8-layer High Bandwidth Memory-2 (HBM2) products. This will help customers release ...
china latest news about Sigfox system-in-package

Sigfox system-in-package

May 6, 2020

ON Semiconductor’s AX-SIP-SFEU is a programmable RF transceiver system-in-package (SiP) integrating an advanced RF system-on-chip (SoC) with all surrounding bill of materials (including a TCXO). The device provides a highly integrated Sigfox solution for both uplink (transmit) and downlink (receive) ...
china latest news about Why System in Package Technology Must Replace System on a Chip Technology

Why System in Package Technology Must Replace System on a Chip Technology

February 5, 2020

System on a chip (SoC) technology has got us a long way, allowing for entire electronic systems to be integrated into a single microchip, and SoC technology has long been the driving force behind smaller and smaller electronic systems with higher and higher levels of performance. Like all great ...
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