March 10, 2021
The drive towards semiconductor miniaturization and integration is rapidly unleashing the power and potential of System-in-Package (SiP), a package or module containing a functional electronic system or sub-system that is integrated and miniaturized through IC assembly technologies. HOREXS is the one of the famous sip package substrate manufacturers of CHINA in System-in-Package (SiP) technologies from sample to small orders and high volume manufacturing while serving a broad spectrum of applications and markets. With attributes that deliver higher performance, cost effectiveness, and shorter time to market, SiP technology is enabling functionality and creating opportunity across limitless electronics applications.
What is System-in-Package (SiP)?
SiP as a package or module that contains a functional electronic system or subsystem that is integrated and miniaturized through IC assembly technologies. Rather than generic IC packaging technologies, development of SiP requires heterogeneous integration of single or multiple chips (such as a specialized processor, DRAM, flash memory), surface mount device (SMD) resistor/capacitor/inductor, filters, connectors, MEMS device, sensors, other active/passive components and pre-assembled package or subsystem.HOREXS always focus on sip package substrate manufacture,do our best to help customers lower substrate manufacture cost under the high quality performance.