Send Message
China BGA Substrate manufacturer

HOREXS GROUP

English
Request A Quote

News

china latest news about HOREXS invested 2 billion on second IC substrate factory,Building now

HOREXS invested 2 billion on second IC substrate factory,Building now

April 26, 2021

IC packaging substrates, also known as IC substrates, are regarded as high-end PCB products in the eyes of investors. The packaging substrate is developed on the basis of the HDI board, and is an extension of high-end technology to adapt to the rapid development of electronic packaging technology. ...
china latest news about Advanced packaging IC semiconductor

Advanced packaging IC semiconductor

March 29, 2021

A technology can become well-known from a relatively narrow professional field. There are historical reasons and it is also inseparable from the promotion of famous companies. It is Apple that brings SiP to the public, and advanced packaging can attract widespread public attention. Because TSMC ...
china latest news about MiniLed/Micro LED will booming very soon

MiniLed/Micro LED will booming very soon

March 29, 2021

In the past few years, the entire LED industry has experienced a cold wave brought about by overcapacity; however, benefiting from the rebound in downstream demand last year, the industry's prosperity also bottomed out. According to Jiwei.com, the new display technology Mini LED has become more and ...
china latest news about More Data, More Memory-Scaling Problems

More Data, More Memory-Scaling Problems

March 11, 2021

Memories of all types are facing pressures as demands grow for greater capacity, lower cost, faster speeds, and lower power to handle the onslaught of new data being generated daily. Whether it’s well-established memory types or novel approaches, continued work is required to keep scaling moving ...
china latest news about DRAM, 3D NAND Face New Challenges

DRAM, 3D NAND Face New Challenges

March 11, 2021

It’s been a topsy-turvy period for the memory market, and it’s not over. So far in 2020, demand has been slightly better than expected for the two main memory types — 3D NAND and DRAM. But now there is some uncertainty in the market amid a slowdown, inventory issues and an ongoing trade war. In ...
china latest news about Process Window Optimization Of DRAM By Virtual Fabrication

Process Window Optimization Of DRAM By Virtual Fabrication

March 11, 2021

New integration and patterning schemes used in 3D memory and logic devices have created manufacturing and yield challenges. Industrial focus has shifted from the scaling of predictable unit processes in 2D structures to the more challenging full integration of complex 3D structures. Conventional 2D ...
china latest news about DRAM’s Persistent Threat To Chip Security

DRAM’s Persistent Threat To Chip Security

March 11, 2021

A well-known DRAM vulnerability called “rowhammer,” which allows an assailant to disrupt or take control of a system, continues to haunt the chip industry. Solutions have been tried, and new ones are being proposed, but the potential for a major attack persists. First discovered some five years ago, ...
china latest news about Manufacturing Bits: DRAM Substrate(HOREXS brand )

Manufacturing Bits: DRAM Substrate(HOREXS brand )

March 11, 2021

At the recent 2020 International Electron Devices Meeting (IEDM), Imec presented a paper on a novel capacitor-less DRAM cell architecture. DRAM is used for main memory in systems, and today’s most advanced devices are based on roughly 18nm to 15nm processes. The physical limit for DRAM is somewhere ...
china latest news about Domain-Specific Memory

Domain-Specific Memory

March 11, 2021

Domain-specific computing may be all the rage, but it is avoiding the real problem. The bigger concern is the memories that throttle processor performance, consume more power, and take up the most chip area. Memories need to break free from the rigid structures preferred by existing software. When ...
china latest news about The Race To Much More Advanced Packaging

The Race To Much More Advanced Packaging

March 11, 2021

Momentum is building for copper hybrid bonding, a technology that could pave the way toward next-generation 2.5D and 3D packages. Foundries, equipment vendors, R&D organizations and others are developing copper hybrid bonding, which is a process that stacks and bonds dies using copper-to-copper ...
Contact Details
China Good Quality BGA Substrate Supplier. © 2020 - 2024 horexspcb.com. All Rights Reserved.