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china latest news about TSMC advanced packaging, the latest progress

TSMC advanced packaging, the latest progress

June 30, 2022

Readers familiar with TSMC should know that the foundry giant has combined its 2.5D and 3D packaging products under one brand - "3D Fabric". As they expect, future customers will pursue both options to provide dense, heterogeneous integration of system-level functions—for example, "front-end" 3D ...
china latest news about U.S. sanctions, Russian semiconductors plummet by 90%

U.S. sanctions, Russian semiconductors plummet by 90%

June 30, 2022

U.S. Commerce Secretary Gina Raimondo said on Wednesday that global semiconductor exports to Russia have plummeted by 90 percent since the United States and its allies imposed export controls on Moscow over Moscow's conflict with Ukraine. Speaking at the Commerce Ministry's annual meeting, Raimondo ...
china latest news about HOREXS supporting Substrate types

HOREXS supporting Substrate types

June 29, 2022

CSP packaging substrate CSP (Chip Scale Packages) Chip Scale Packaging (CSP) utilizes fine pattern technology, very small via's, ultra thin copper foil and build up structure for high density designs and flexibility. The CSP substrate provides high reliability in both connection and isolation. ...
china latest news about Speed up IC Substrate manufacture,HOREXS 2nd plant running in July

Speed up IC Substrate manufacture,HOREXS 2nd plant running in July

June 13, 2022

According to jiwei news, on May 16, Wang Nan, deputy director of the Huangshi City Innovation and Development Center, Hubei Province, and the relevant persons in charge of the Planning Office and Information Promotion Section of the Municipal Economic and Information Bureau visited and investigated ...
china latest news about How will DRAM shrink?

How will DRAM shrink?

April 28, 2021

At the SPIE Advanced Lithography Conference held in February 2021, Regina Pendulum of Applied Materials delivered a speech entitled "Module-Level Material Engineering for Continued DRAM Scaling". In the speech, Regina emphasized that the shrinking of DRAM is slowing down, and new solutions are ...
china latest news about How will DRAM shrink?

How will DRAM shrink?

April 28, 2021

At the SPIE Advanced Lithography Conference held in February 2021, Regina Pendulum of Applied Materials delivered a speech entitled "Module-Level Material Engineering for Continued DRAM Scaling". In the speech, Regina emphasized that the shrinking of DRAM is slowing down, and new solutions are ...
china latest news about The UK should also vigorously develop local semiconductors?

The UK should also vigorously develop local semiconductors?

April 28, 2021

Events currently happening around the world have proved the importance of semiconductors, but what is shocking is that there are almost no IC foundries in the UK. Should the UK consider developing its own semiconductors, including foundries? Why is manufacturing semiconductors important? The ability ...
china latest news about Production capacity for packaging and testing is tight, OSAT sweeps machines to prepare for battle

Production capacity for packaging and testing is tight, OSAT sweeps machines to prepare for battle

April 28, 2021

According to the Taiwan Media Business Times, the semiconductor packaging and testing capacity was severely tight in the first half of the year. The leading manufacturer ASE Investment and Control swept over thousands of wire bonding machines, and the machine equipment delivery time was greatly ...
china latest news about Why is the semiconductor packaging and testing industry transitioning from IDM to OSAT?

Why is the semiconductor packaging and testing industry transitioning from IDM to OSAT?

April 28, 2021

In the post-Moore era, the performance enhancements produced by advanced processes are no longer sufficient to meet future application requirements. As ai (artificial intelligence) and hpc high-performance computing have become the focus of the semiconductor industry, the traditional semiconductor ...
china latest news about The price increase has spread to packaging and testing plants, and the overall price increase will be 20%-30%

The price increase has spread to packaging and testing plants, and the overall price increase will be 20%-30%

April 28, 2021

Demand in the semiconductor industry is fierce. Not only is the upstream foundry capacity fully loaded, but also the downstream testing and packaging capacity is in short supply. In addition to canceling the off-season price discount, prices have also increased. Recently, packaging and testing ...
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