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According to jiwei news, on May 16, Wang Nan, deputy director of the Huangshi City Innovation and Development Center, Hubei Province, and the relevant persons in charge of the Planning Office and Information Promotion Section of the Municipal Economic and Information Bureau visited and investigated the HOREXS 2nd ic substrate factory building.

During the survey, Wang Nan, deputy director of the Municipal Innovation and Development Center, fully affirmed the achievements of HOREXS in project construction, competition for projects, and cooperation and support. Jianghui, the section chief of the Information Promotion Section of the Municipal Economic and Information Bureau, encouraged HOREXS to increase investment in technology research and development while doing a good job in infrastructure and marketing, and actively apply for provincial-level special support projects such as technological transformation.

HOREXS, as the lead unit of the PCB industry chain chain in Huangshi City, the Municipal Innovation and Development Center will always pay close attention to the development of enterprises in the industry chain, coordinate and solve the development difficulties of enterprises in a timely manner, and comprehensively do a good job in service guarantee work, in order to promote the high-quality development of the PCB industry chain "Come on and empower".

The HOREXS packaging substrate project has a total investment of more than 800 million and a land area of 100 acres. It mainly produces packaging substrates for communications, life, automobiles, and storage/Memory. After the project is completed, the annual output of packaging substrates will be 1 million square meters. At present, the first phase of the plant has been basically completed, and the trial production is expected to be completed within this year (commissioning in July). After all the projects are completed and put into production, the annual operating income can reach more than 1 billion.

According to China Semiconductor's public announcement, the packaging substrate project invested and constructed by HOREXS (Hubei) Electronics Co.Ltd, builds packaging substrates with a monthly production capacity of more than 50,000 square meters, supporting the development of high-end chip industries at home and abroad. The total investment of the project is expected to exceed 1 billion yuan (of which the investment in fixed assets is about 800 million yuan). It is located in Huangshi City, Hubei Province (Nearby unimicron factory).

The packaging substrate project invested and constructed this time is in line with the company's current strategic layout. It is an important measure for the company to expand its existing semiconductor business and enter high-end products. It will increase the category and scale of the company's semiconductor products and meet the company's future business development needs and production capacity layout. The demand for expansion is conducive to further enhancing the company's comprehensive strength and enhancing the company's market competitiveness.

In response to possible market risks, HOREXS said that the company's existing factories already have a relatively complete technical capability and quality capability platform for fine circuit products, and the packaging substrate technology of the Hubei factory will be deeply incubated on the basis of the existing platform; With the rich experience and first-mover advantages accumulated in the technology, process, operation, management, talents and customers of the substrate, we can realize the large-scale output of the project as soon as possible and seize the market opportunity. At the same time, the company will pay full attention to changes in the macro environment, industry and market, constantly adapt to new development requirements, and respond to market risks by improving internal management, actively exploring markets, and continuously improving product market differentiation and competitiveness.

It is worth noting that this is only one part of the HOREXS layout IC carrier board. As one of the pioneers in the domestic IC packaging substrate industry, the company invested in the IC packaging substrate industry as early as 2010. Through years of continuous R&D investment, it has achieved breakthroughs and accumulation in the market, technical process, team, and quality. The company occupies one of the leading positions in China in terms of thin plate processing capability and fine routing capability. At present, it has established cooperative relations with mainstream chip packaging manufacturers and brands at home and abroad.

HOREXS said in a recent survey by the Huangshi Municipal Government that the current production capacity of the Huizhou production base of 15,000 square meters per month has achieved full production and full sales, and the overall yield rate has remained at around 98%; it will fully invest in the new Hubei Huangshi packaging substrate in 2020. The factory will start trial production in July 2022, and is expected to enter the mass production stage in August, achieving a monthly capacity utilization target of more than 80% by the end of this year. On the in-depth development blueprint of packaging substrates, HOREXS has not stopped there. Following the release of the first phase of production capacity, the second and third phases of the factory will be built in stages. The preliminary plan is to complete and put into operation by the end of 2025. After completion, the products will cover ABF/BT Material package substrate. It is conducive to breaking the situation that the packaging substrate is basically monopolized by a few manufacturers in Japan, South Korea, and Taiwan, China, and gradually realize the localization of substitution, and solve the problem of stuck neck technology and products.

Looking forward to the future, HOREXS pointed out that based on the judgment of industry trends, customer needs and the company's own technology and product upgrade needs, the company's future focus is to promote the investment and expansion of Hubei HOREXS IC packaging substrate project. In the future, the competitiveness of the packaging substrate business will be improved mainly by improving R&D capabilities, digital transformation, and strengthening the depth of cooperation with major customers, so as to achieve efficiency improvement and steady growth. In the long run, with the gradual commissioning and production of the company's IC packaging substrate business, the revenue and profit share of the semiconductor business will gradually increase in the future.

HOREXS-Hubei is belong to HOREXS Group, is one of the leading and fast-growing Chinese IC substrate manufacturer.Which was located in Huangshi city of Hubei province China. Factory-Hubei is more than 60000 square meters floor space, which invested more than 300 million USD.

IC Substrate Capacity 600,000SQM/Year,Tenting&SAP process. HOREXS-Hubei is committed to the development of IC substrate in China, striving to become one of the top three IC substrate manufacturers in China, and striving to become a world-class IC board manufacturer in the world .

Technology like L/S 20/20un,10/10um.BT+ABF materials. Support: Wire bonding Substrate Wire bonding(BGA) Substrate Embedded (Memor y IC substrate) MEMS/CMOS,Module(RF,Wireless ,Bluetooth) 2/4/6L (1+2+1/2+2+2/1+4+1),Buildup(Buried/Blind hole) Flipchip CSP; Others ultra ic package substrate.