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china latest news about HOREXS new plant (package substrate) factory was put into production

HOREXS new plant (package substrate) factory was put into production

September 1, 2022

Recently, it is reported that the first phase of the IC carrier board (also known as packaging substrate) factory built by Hongruixing (Hubei) Electronics Co., Ltd. (hereinafter referred to as "Hongruixing & HOREXS") has been put into trial production recently, and is currently undertaking It has ...
china latest news about HOREXS facility

HOREXS facility

October 13, 2022

IC carrier board, also known as package substrate, is a carrier that connects and transmits signals between a bare chip (DIE) and a printed circuit board (PCB). It can be understood as a high-end PCB product. The function of the IC carrier board is mainly to protect the circuit, fix the circuit and ...
china latest news about HOREXS declaration

HOREXS declaration

September 26, 2022

Dear customers Due to our business development and adjustment, our main business and focus will all transfer to our Hubei center, the “HongruiXing (Hubei) Electronics Co. Ltd.”; All the business will integrate into Hongrui Xing (Hubei) Electronics Co. Ltd.; So from October, please place all the ...
china latest news about ​IC Substrate Technology Overview

​IC Substrate Technology Overview

July 25, 2022

IC Substrate Technology Overview It is called an IC carrier board. A substrate used to package IC bare chips. effect: (1) Carrying semiconductor IC chips. (2) Internal circuits are arranged to conduct the connection between the chip and the circuit board. (3) Protect, fix and support IC chips and ...
china latest news about HOREXS support SIP(System in package) substrate manufacture

HOREXS support SIP(System in package) substrate manufacture

July 11, 2022

Introduction of SIP Sip is integrated and miniaturized through IC assembly technologies. Rather than generic IC packaging technologies, development of SiP requires heterogeneous integration of single or multiple chips (such as a specialized processor, DRAM, flash memory), surface mount device (SMD) ...
china latest news about HOREXS support FBGA package substrate production

HOREXS support FBGA package substrate production

July 11, 2022

Introduction of FBGA The Fine Pitch Ball Grid Array, or FPBGA or FBGA, is a smaller version of the ball grid array (BGA) package. As in all BGA packages, FBGA's use solder balls that are arranged in a grid or array at the bottom of the package body for external electrical connection. However, the ...
china latest news about Packaging substrates are in the golden track, and multiple factors accelerate domestic expansion

Packaging substrates are in the golden track, and multiple factors accelerate domestic expansion

July 4, 2022

Packaging substrates are the main driving force for the growth of the packaging material market. In 2026, the industry scale of IC packaging substrates for domestic companies in mainland China is expected to exceed US$1.9 billion. - Japan, South Korea, and Taiwan, China are three pillars of the IC ...
china latest news about ABF material substrate in short supply

ABF material substrate in short supply

July 1, 2022

As we all know, semiconductor is a very typical cyclical industry. This feature is reflected in the entire industry chain from upstream equipment and materials, to chip design, and then to wafer manufacturing, even if it is only a small amount required in chip packaging. ABF carrier boards are no ...
china latest news about The NAND memory industry landscape is undergoing a major reorganization

The NAND memory industry landscape is undergoing a major reorganization

June 30, 2022

After a lapse of six years, storage equipment giant Western Digital may make another major strategic adjustment. In an official statement released this month, Western Digital said it may split itself into a company focused on traditional computer HDDs and a NAND flash memory company. Western Digital ...
china latest news about Evolution of CMOS Image Sensor Architectures

Evolution of CMOS Image Sensor Architectures

June 30, 2022

The development of CMOS image sensors and the prospect of using advanced imaging technologies promises to improve the quality of life. With the rapid emergence of parallel analog-to-digital converter (ADC) and backside illuminated (BI) technologies, CMOS image sensors currently dominate the digital ...
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