HOREXS GROUP
September 1, 2022
Recently, it is reported that the first phase of the IC carrier board (also known as packaging substrate) factory built by Hongruixing (Hubei) Electronics Co., Ltd. (hereinafter referred to as "Hongruixing & HOREXS") has been put into trial production recently, and is currently undertaking It has received orders from customers including Samsung, and will officially undertake mass production orders in September.
In addition, according to the relevant person in charge of Hongruixing, Hongruixing's current customers are located in Asia, America, Europe and other countries, and most of them have established strategic cooperative relations. The series of products of this factory are mainly based on the manufacturing of packaging substrates in the direction of semiconductor packaging (OSAT) and Fabless. In order to solve the current situation of IC substrates in China being monopolized by Japan, South Korea and Taiwan, and help the development of the national semiconductor industry.
Hongruixing (Hubei) Electronics Co., Ltd., formerly known as Boluo County Hongruixing Electronics Co., Ltd., is located in the National Economic Development Zone of Huangshi City, Hubei Province, with a registered capital of 120 million yuan. For the current semiconductor industry Sip packaging substrates, FCCSP/CSP packaging substrates, BGA/LGA packaging substrates, MEMS/CMOS packaging substrates, etc., mass production capacity has been achieved, and relevant independent intellectual property rights have been obtained.
While breaking the monopoly of very few foreign companies, it further reduces manufacturing costs for customers and improves the competitiveness of customers' products. Finally, according to the relevant person in charge of Hongruixing, the second and third phases of the factory are mainly to expand production capacity and supply and develop FCBGA (ABF-based) packaging substrate manufacturing will continue to advance at the end of 2023, and the continuous development and progress of Hongruixing will contribute to filling the gap in the production of large-scale microelectronic integrated circuits in my country.
