HOREXS GROUP
July 11, 2022
The Fine Pitch Ball Grid Array, or FPBGA or FBGA, is a smaller version of the ball grid array (BGA) package. As in all BGA packages, FBGA's use solder balls that are arranged in a grid or array at the bottom of the package body for external electrical connection. However, the FBGA is near-chip-scale in size, with a smaller and thinner body than the standard BGA package. As its name implies, it also features a finer ball pitch (smaller distance between balls).
Typical FBGA's have ball counts that range from 25 to 529 solder balls. The typical FBGA ball pitch is 0.8 mm to 1.0 mm, although thinner versions of the FBGA such as the TFBGA and the VFBGA can have ball pitches that are as low as 0.4 mm. A typical FBGA is about 1.3 mm to 1.7 mm thick.
| No. of Balls | Body Size |
Package Height (incl. solder balls) |
Ball Pitch |
| 49 | 7x7mm | 1.4mm | 0.8mm |
| 63 | 10x10mm | 1.5mm | 0.8mm |
| 80 | 9x9mm | 1.5mm | 0.8mm |
| 128 | 11x11mm | 1.4mm | 0.8mm |
| 165 | 15x17mm | 1.3mm | 1.0mm |
Overall package height max. 1.4mm to 0.65mm
• Eutectic / Pb free solder balls
• Solder ball pitch 0.4mm to 1.0mm
• Green package available
• 2-4 layer substrates
• Fine pitch ball grid array package .
• Near chip scale package
• Available in Land Grid Array (LGA) format
• JEDEC standard compliant
