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March 10, 2021

Flip Chip Packaging substrate HOREXS

Flip chip derived its name from the method of flipping over the chip to connect with the substrate or leadframe. Unlike conventional interconnection through wire bonding, flip chip uses solder or gold bumps. Therefore, the I/O pads can be distributed all over the surface of the chip and not only on the peripheral region. The chip size can be shrunk and the circuit path, optimized. Another advantage of flip chip is the absence of bonding wire reducing signal inductance.
An essential process for flip chip packaging is wafer bumping. Wafer bumping is an advanced packaging technique where ‘bumps’ or ‘balls’ made of solder are formed on the wafers before being diced into individual chips. HOREXS has invested significantly in the research and development it and still not stop.


Flip chip technology is gaining popularity due to

Shorter assembly cycle time
All the bonding for flip chip packages is completed in one process.
Higher signal density & smaller die size
Area array pad layout increases I/O density. Also, based on the same number of I/Os, the size of the die can be significantly shrunk.
Good electrical performance
Shorter path between die and substrate improves the electrical performance.
Direct thermal dissipation path
External heat sink can be directly added to the chip to remove the heat.
Lower packaging profile
Absence of wire and molding allows flip chip packages to feature lower profiles.





MSAP /SAP manufacture

HOREXS invested a billion on second ic package substrate factory since in 2020,After finished manufacture capacity will reach to 1million SQM monthly,such as Flipchip package substrate,Module substrate,Memory card substrate,MEMS substrate,MicroLED substrate,Sip package substrate and more.

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