Leave a Message

We will call you back soon!

HongRuiXing (Hubei) Electronics Co.,Ltd. Your message must be between 20-3,000 characters!

HongRuiXing (Hubei) Electronics Co.,Ltd. Please check your E-mail!

SUBMIT

More information facilitates better communication.

Mr.
  • Mr.
  • Mrs.
OK

Submitted successfully!

We will call you back soon!

OK

Leave a Message

We will call you back soon!

HongRuiXing (Hubei) Electronics Co.,Ltd. Your message must be between 20-3,000 characters!

HongRuiXing (Hubei) Electronics Co.,Ltd. Please check your E-mail!

SUBMIT
Please leave your correct email and detailed requirements.
OK
China BGA Substrate manufacturer

HOREXS GROUP

English
  • English
  • French
  • German
  • Italian
  • Russian
  • Spanish
  • Portuguese
  • Dutch
  • Greek
  • Japanese
  • Korean
  • Arabic
  • Hindi
  • Turkish
  • Indonesian
  • Vietnamese
  • Thai
  • Bengali
  • Persian
  • Polish
Request A Quote
  • Home
  • Products
    • BGA Substrate
    • IC Package Substrate
    • Sip Package Substrate
    • FCCSP Package Substrate
    • Sensors Substrate
    • RF Module Substrate
    • Memory Substrate
    • MEMS Substrate
    • IoT Substrate
    • Other Ultrathin Substrate
    • Ultrathin Rigid PCB
    • Medical Equipment PCB
  • About Us
  • Factory Tour
  • Quality Control
  • Contact Us
  • News
Products
Home / Products / FCCSP Package Substrate

0.3mm FCCSP Package Substrate 4L Buildup Types ENEPIG 5*5mm BT Material

0.3mm FCCSP Package Substrate 4L Buildup Types ENEPIG 5*5mm BT Material
0.3mm FCCSP Package Substrate 4L Buildup Types ENEPIG 5*5mm BT Material 0.3mm FCCSP Package Substrate 4L Buildup Types ENEPIG 5*5mm BT Material 0.3mm FCCSP Package Substrate 4L Buildup Types ENEPIG 5*5mm BT Material
Basic Information
Place of Origin: china
Brand Name: Horexs
Certification: UL
Minimum Order Quantity: 1 square meter
Price: US 85-100 per square meter
Packaging Details: carton customized
Delivery Time: 7-10 working days
Payment Terms: L/C, D/P, T/T, Western Union, MoneyGram
Supply Ability: 30000 square meters per month
Get Best Price Contact Now Chat Now
  • Detail Information
  • Product Description
Material: BT Thickness: 0.3mm
Size: 5*5mm Color: Green
Name: FCCSP Package Substrate Layer: 1-6 Layer (Customize)
High Light:

ENEPIG FCCSP package substrate

,

Buildup Types FCCSP package substrate

,

0.3mm FCCSP substrate

Application:IC assembly,Semiconductor package,IC package,Consumer electronics,Computer,others;

Spec.of Substrate production:

Mini.Line space/width:1mil (25um)

Finished thickness:0.3mm;

Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others;

Surface finished:Mainly immersion gold,support customize such as OSP/Immersion silver,tin,more;

Copper:0.5oz or Customize;

Layer:1-6 layer (Customize);

Soldermask:Green or Customize (Brand:Soldermask:TAIYO INK,ABQ)

 

Short introduction of Horexs Manufacturer:

HOREXS-Hubei is belong to HOREXS Group, is one of the leading and fast-growing Chinese IC substrate manufacturer.Which was located in Huangshi city of Hubei province China. Factory-Hubei is more than 60000 square meters floor space, which invested more than 300 million USD. IC Substrate Capacity 600,000SQM/Year,Tenting&SAP process. HOREXS-Hubei is committed to the development of IC substrate in China, striving to become one of the top three IC substrate manufacturers in China, and striving to become a world-class IC board manufacturer in the world . Technology like L/S 20/20un,10/10um.BT+ABF materials. Support: Wire bonding Substrate Wire bonding(BGA) Substrate Embedded (Memor y IC substrate) MEMS/CMOS,Module(RF,Wireless ,Bluetooth) 2/4/6L (1+2+1/2+2+2/1+4+1),Buildup(Buried/Blind hole) Flipchip CSP; Others ultra ic package substrate.

 

When you send inquiry us,Pls be know that we have to get the following :

1-Substrate production sepc. information;

2-Gerber files(Substrate designer/engineer can export it from your layout software,also send us drilling file)

3-Quantity request,Including sample;

4-Multilayer Substrate,please also provide us layer stack-up/Buildup information;

 

Process Capability
Our Technology
• Fine pattern by MSAP(20/20um) and Tenting(30/30um)
• Various Applicable Technical Option
- Thin Core Technology
- All type Surface Finish
- SR Flatness Process, Build up / Via Filling Tech.
- Tailless, Etch-back Process
- Fine Pitch SOP process
• High Quality and Reliability Substrate
• High Speed Delivery : No need film, No outsourcing
• Competitive Low Running Cost

 

Shipping supporting:

DHL/UPS/Fedex;

By air;

Customize express(DHL/UPS/Fedex)

Tag:

Antenna PCB For Handwriting,

2 Layer 0.1mm Antenna PCB,

0.1mm PCB Lead Free

Contact Details
Mark Liu

Phone Number : 13927393064

More FCCSP Package Substrate
  • FCCSP substrate manufacture supporting China
    Show Details

    FCCSP substrate manufacture supporting China

    Contact Now
  • BT FCCSP Package Substrate 3x3mm Green Color For Flip Chip Assembly
    Show Details

    BT FCCSP Package Substrate 3x3mm Green Color For Flip Chip Assembly

    Contact Now
  • BT FCCSP Package Substrate 3x3mm Green Color For Flip Chip Assembly
    Show Details

    BT FCCSP Package Substrate 3x3mm Green Color For Flip Chip Assembly

    Contact Now
  • Flip Chip CSP Package Substrate 5x5mm Green Color BT Material
    Show Details

    Flip Chip CSP Package Substrate 5x5mm Green Color BT Material

    Contact Now
Categories
  • BGA Substrate
  • IC Package Substrate
  • Sip Package Substrate
  • FCCSP Package Substrate
Factory Tour
  • Production Line
  • OEM/ODM
  • R&D
About Us
  • Introduction
  • History
  • Service
  • Our Team
Contact Us
HongRuiXing (Hubei) Electronics Co.,Ltd.
Tianyue building 711,518100 shajing centre bao'an district Shenzhen city
86-0752-6166099 markliu@hrxpcb.cn
  • Privacy Policy
  • Sitemap
  • Mobile Site
China Good Quality BGA Substrate Supplier. © 2020 - 2023 horexspcb.com. All Rights Reserved.