RF Module substrate impedance control 4L BT material soft gold

Basic Information

Place of Origin:	china
Brand Name:	Horexs
Certification:	UL
Model Number:	GC-01

Minimum Order Quantity:	1000pieces
Price:	US 0.089-0.109 each piece
Packaging Details:	carton customized
Delivery Time:	7-10 working days
Payment Terms:	L/C, D/P, T/T, Western Union, MoneyGram
Supply Ability:	30000sqm/ month

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Type:	RF Substrate	Material:	BT
Finished Thk.:	0.21mm	Finished:	Soft Gold
Layer:	4L
Highlight:	Goldfinger Fingerprint Recognition PCB , FR4 Fingerprint Recognition PCB , 0.15mm Fingerprint Recognition PCB

Application:Semiconductor package,IC package,WIFI module/Bluetooth module,Others;

Spec.of Substrate production:

Mini.Line space/width:1mil (35um)

Finished thickness:0.21mm;

Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others;

Surface finished:Mainly immersion gold,support customize such as OSP/Immersion silver,tin,more;

Copper:0.5oz or Customize;

Layer:1-6 layer (Customize);

Soldermask:Green or Customize (Brand:Soldermask:TAIYO INK,ABQ)

RF Module substrate impedance control 4L BT material soft gold 0

Short introduction of Horexs Manufacture:

HOREXS-Hubei is belong to HOREXS Group, is one of the leading and fast-growing Chinese IC substrate manufacturer.Which was located in Huangshi city of Hubei province China. Factory-Hubei is more than 60000 square meters floor space, which invested more than 300 million USD. IC Substrate Capacity 600,000SQM/Year,Tenting&SAP process. HOREXS-Hubei is committed to the development of IC substrate in China, striving to become one of the top three IC substrate manufacturers in China, and striving to become a world-class IC board manufacturer in the world . Technology like L/S 20/20un,10/10um.BT+ABF materials. Support: Wire bonding Substrate Wire bonding(BGA) Substrate Embedded (Memor y IC substrate) MEMS/CMOS,Module(RF,Wireless ,Bluetooth) 2/4/6L (1+2+1/2+2+2/1+4+1),Buildup(Buried/Blind hole) Flipchip CSP; Others ultra ic package substrate.

When you send inquiry us,Pls be know that we have to get the following :

1-Substrate production sepc. information;

2-Gerber files(Substrate designer/engineer can export it from your layout software,also send us drilling file)

3-Quantity request,Including sample;

4-Multilayer Substrate,please also provide us layer stack-up/Buildup information;

Finally,If you are very big customers,Pls also let's know the details of your demand,Horexs also can support your technical supporting if you need! HOREXS 's mission is that help you save cost with same high quality guarantee!

Want Better price,Better quality Substrate ? Contact Horexs now!

Shipping supporting:

DHL/UPS/Fedex;

By air;

Customize express(DHL/UPS/Fedex)

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Camera / Bluetooth / Wireless Module Substrate BT 4L 0.21mm Soft Gold Finished
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RF Module substrate impedance control 4L BT material soft gold

Goldfinger Fingerprint Recognition PCB

FR4 Fingerprint Recognition PCB

0.15mm Fingerprint Recognition PCB

0.1mm PCB For IC Card,

0.1mm Fingerprint Recognition PCB,

2 Layer Fingerprint Recognition PCB

Camera / Bluetooth / Wireless Module Substrate BT 4L 0.21mm Soft Gold Finished