Leave a Message
We will call you back soon!
Your message must be between 20-3,000 characters!
Please check your E-mail!
More information facilitates better communication.
Submitted successfully!
We will call you back soon!
Leave a Message
We will call you back soon!
Your message must be between 20-3,000 characters!
Please check your E-mail!
Place of Origin: | china |
---|---|
Brand Name: | Horexs |
Certification: | UL |
Model Number: | FC-01 |
Minimum Order Quantity: | 10 squre meters |
Price: | US 150-165 per square meter |
Packaging Details: | carton customized |
Delivery Time: | 7-10 working days |
Payment Terms: | L/C, D/P, T/T, Western Union, MoneyGram |
Supply Ability: | 1000M2/ month |
Type: | Flexible Circuit Board | Dielectric Layer: | TR-4 |
---|---|---|---|
Material: | Complex | Flame Retardant Properties: | V2 |
Mechanical Rigid: | Rigid | Processing Technic: | Electrolytic Foil |
Transport Package: | Carton | ||
High Light: | 0.4mm Ultrathin Rigid PCB,Ultrathin Rigid PCB 0.4mm,0.4mm Ultrathin PCB |
0.4mm finished FR4 circuit boards fabrication with High Quality Gold Plating PCB Board Taiyo White Solder Mask ROHS
Application:Dram memory electronics,Sd card,memory card,all kind of memor ycard,MicroSD,MicroTF card,Flash memory card,DDR,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;
Spec.of pcb production:
Mini.Line space/width:1mil (25um)
Finished thickness:FR4 (0.1-0.4mm) finished thickness;
Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others;
Surface finished:Mainly immersion gold,support customize such as OSP/Immersion silver,tin,more;
Copper:0.5oz or Customize;
Layer:1-6 layer (Customize);
Soldermask:Green or Customize (Brand:Soldermask:TAIYO INK,ABQ)
Short introduction of Horexs Manufacturer:
HOREXS is whole process ultra thin FR4 PCB manufacturer in CHINA,It's also one of the famous thin FR4 PCB (IC Susbtrate ) manufacturers in CHINA,which has AVI,AOI for checking,3 LDI for soldermask and circuit line,Mekki brand laminate press machines,Quality yield more than 99.7%,quite Stable quality guaratnee! Welcome to visit us to check it too!
Almost of Horexs production machines are from Japan,high precision for production,It's also the reason of stable quality guarantee!
Welcome contact Horexs to produce your design/your idea/your pcb boards ,your layout desing.
Horexs's Products are widely used in IC assembly/IC substrate package, smart card, IC card, Micro SD,Sensor package, eMMC,BGA,UFS,eMCP,uMCP,DDR4,MEMS, small TF card, SD card, SIM card, high voltage circuit breaker, a tablet computer, electronic antenna, tag, microphone, 3D optical technique.
When you send inquiry us,Pls be know that we have to get the following :
1-PCB production sepc. information;
2-Gerber files(PCB designer/engineer can export it from your layout software,also send us drilling file)
3-Quantity request,Including sample;
4-For multilayer thin FR4 PCB,please also provide us layer stack-up information;
Finally,If you are very big customers,Pls also let's know the details of your demand,Horexs also can support your technical supporting if you need!HOREXS 's mission is that help you save cost with same high quality guarantee!
Want Better price,Better quality pcb ? Contact Horexs now!
Shipping supporting:
DHL/UPS/Fedex;
By air;
Customize express(DHL/UPS/Fedex)
Capability
Item | Capability | PS | ||
Corboard | Uniformity +/-10% | |||
mass production | sample | |||
hole size | 100um | 100um | finished hole size | |
banding finger | pitch | 105um | 95um | |
width | 35um | 35um | ||
patter | pitch | 95um | 90um | |
line width | 25um | 25um | ||
line space | 25um | 25um | ||
hole ring | PTH:80um | 80um | ||
thickness | double side | 100um | 100um | finishied whole board size |
multilayer | 4L:300um | 4L:240um | ||
line or PAD to board edge | 100um | 100um | ||
S/M | window | 50um | 50um | |
bridge | 80um | 70um | ||
color | black | black | can customize | |
thinckness | 20+/-5um | 20+/-5um | ||
flatness | <5um | <5um | ||
position | +/-50um | +/-50um |
surface treatment | electric or chemical gold/ OSP | / | |||
technology | type | Min | Max | ||
thickness |
immersion gold | Ni | 2.54um | 6.0um | BGA |
Au | 0.03um | 0.50um | |||
platinggold | NI | 5um | 10um | Bonding finger | |
AU | 0.3um | 0.6um | |||
OSP | OSP | 0.25um | 0.5um | BGA | |
hole wall | Cu | 10um | 20um |