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HOREXS GROUP

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Home / Products / FCCSP Package Substrate

Flip Chip CSP Package Substrate 5x5mm Green Color BT Material

Flip Chip CSP Package Substrate 5x5mm Green Color BT Material
Flip Chip CSP Package Substrate 5x5mm Green Color BT Material Flip Chip CSP Package Substrate 5x5mm Green Color BT Material Flip Chip CSP Package Substrate 5x5mm Green Color BT Material
Basic Information
Place of Origin: china
Brand Name: Horexs
Certification: UL
Minimum Order Quantity: 1 square meter
Price: US 85-100 per square meter
Packaging Details: carton customized
Delivery Time: 7-10 working days
Payment Terms: L/C, D/P, T/T, Western Union, MoneyGram
Supply Ability: 30000 square meters per month
Get Best Price Contact Now Chat Now
  • Detail Information
  • Product Description
Material: BT Thickness: 0.3mm
Size: 5*5mm Color: Green
High Light:

CSP package substrate

,

5x5mm CSP package substrate

,

BT FCCSP Package Substrate

Flip Chip CSP package substrate production supporting

Application:IC assembly,Mobile phone,Smart phone,Digital camera electronics,Semiconductor package,IC package,Consumer electronics,Computer,PC/Server : DRAM, SRAM,Smart Mobile Devices ,AP, Baseband, Finger print sensor, etc.Network : Bluetooth, RF, others;

 

Applicable up to 35µm pitch for flip-chip assembly (peripheral)
Thin build-up laminate for SiP applications (0.3mmt for 1-2-1)
Applicable environmentally-friendly products (Halogen-free, Lead-free)
Various surface finish options are available
(Au plating, Lead-free solder coating, OSP, etc.)

Flip Chip CSP Package Substrate 5x5mm Green Color BT Material 0

 

Spec.of Substrate production:

Mini.Line space/width:1mil (25um)

Finished thickness:0.3mm;

Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others;

Surface finished:Mainly immersion gold,support customize such as OSP/Immersion silver,tin,more;

Copper:0.5oz or Customize;

Layer:1-6 layer (Customize);

Soldermask:Green or Customize (Brand:Soldermask:TAIYO INK,ABQ)

Flip Chip CSP Package Substrate 5x5mm Green Color BT Material 1

Flip Chip CSP Package Substrate 5x5mm Green Color BT Material 2

 

Short introduction of Horexs Manufacturer:

HOREXS-Hubei is belong to HOREXS Group, is one of the leading and fast-growing Chinese IC substrate manufacturer.Which was located in Huangshi city of Hubei province China. Factory-Hubei is more than 60000 square meters floor space, which invested more than 300 million USD. IC Substrate Capacity 600,000SQM/Year,Tenting&SAP process. HOREXS-Hubei is committed to the development of IC substrate in China, striving to become one of the top three IC substrate manufacturers in China, and striving to become a world-class IC board manufacturer in the world . Technology like L/S 20/20un,10/10um.BT+ABF materials. Support: Wire bonding Substrate Wire bonding(BGA) Substrate Embedded (Memor y IC substrate) MEMS/CMOS,Module(RF,Wireless ,Bluetooth) 2/4/6L (1+2+1/2+2+2/1+4+1),Buildup(Buried/Blind hole) Flipchip CSP; Others ultra ic package substrate.

 

When you send inquiry us,Pls be know that we have to get the following :

1-Substrate production sepc. information;

2-Gerber files(Substrate designer/engineer can export it from your layout software,also send us drilling file)

3-Quantity request,Including sample;

4-Multilayer Substrate,please also provide us layer stack-up/Buildup information;

 

Finally,If you are very big customers,Pls also let's know the details of your demand,Horexs also can support your technical supporting if you need! HOREXS 's mission is that help you save cost with same high quality guarantee!

 

Want Better price,Better quality Substrate ? Contact Horexs now!

 

Shipping supporting:

DHL/UPS/Fedex;

By air;

Customize express(DHL/UPS/Fedex)

Tag:

Antenna PCB For Handwriting,

2 Layer 0.1mm Antenna PCB,

0.1mm PCB Lead Free

Contact Details
Aken

Phone Number : +8613825288578

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