HOREXS GROUP
| Place of Origin: | china |
|---|---|
| Brand Name: | Horexs |
| Certification: | UL |
| Model Number: | NC-03 |
| Minimum Order Quantity: | Sample or Mass production |
| Price: | Depend on customized spec. |
| Packaging Details: | carton customized |
| Delivery Time: | 7-10 working days |
| Payment Terms: | L/C, D/P, T/T, Western Union, MoneyGram |
| Supply Ability: | 30000 square meters per month |
| Base Material: | BT | Application: | Telecommunication |
|---|---|---|---|
| Solder Mask Color: | Green/black/white/red/blue/yellow | Type: | Ic Package Substrate |
| High Light: | Horexs Bga Circuit Board,Ultra Thin Bga Circuit Board,Bga Circuit Board With Wire Bonding |
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Application:Memory card,UDP,bonding PCB printed circuit boards;Memory card,MicroSD card,MicroTF card,Memory card;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage;
Spec.of Substrate production:
Mini.Line space/width:1mil (25um)
Finished thickness:0.29mm;
Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others;
Surface finished:Mainly immersion gold,support customize such as OSP/Immersion silver,tin,more;
Copper:0.5oz or Customize;
Layer:4 layer (Customize);
Soldermask:Green or Customize (Brand:Soldermask:TAIYO INK)
Short introduction of Horexs Manufacturer:
HOREXS-Hubei is belong to HOREXS Group, is one of the leading and fast-growing Chinese IC substrate manufacturer.Which was located in Huangshi city of Hubei province China. Factory-Hubei is more than 60000 square meters floor space, which invested more than 300 million USD. IC Substrate Capacity 600,000SQM/Year,Tenting&SAP process. HOREXS-Hubei is committed to the development of IC substrate in China, striving to become one of the top three IC substrate manufacturers in China, and striving to become a world-class IC board manufacturer in the world . Technology like L/S 20/20un,10/10um.BT+ABF materials. Support: Wire bonding Substrate Wire bonding(BGA) Substrate Embedded (Memor y IC substrate) MEMS/CMOS,Module(RF,Wireless ,Bluetooth) 2/4/6L (1+2+1/2+2+2/1+4+1),Buildup(Buried/Blind hole) Flipchip CSP; Others ultra ic package substrate.
When you send inquiry us,Pls be know that we have to get the following :
1-Substrate production sepc. information;
2-Gerber files(Substrate designer/engineer can export it from your layout software,also send us drilling file)
3-Quantity request,Including sample;
4-Multilayer substrates,please also provide us layer stack-up information;
Finally,If you are very big customers,Pls also let's know the details of your demand,Horexs also can support your technical supporting if you need!HOREXS 's mission is that help you save cost with same high quality guarantee!
Want Better price,Better quality substrate ? Contact Horexs now!
Shipping supporting:
DHL/UPS/Fedex;
By air;
Customize express(DHL/UPS/Fedex)
