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HOREXS GROUP

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Home / Products / Ultrathin Rigid PCB

0.1mm 0.4mm Thickness L/S 35um Ultra Thin Pcb

0.1mm 0.4mm Thickness L/S 35um Ultra Thin Pcb
0.1mm 0.4mm Thickness L/S 35um Ultra Thin Pcb 0.1mm 0.4mm Thickness L/S 35um Ultra Thin Pcb 0.1mm 0.4mm Thickness L/S 35um Ultra Thin Pcb 0.1mm 0.4mm Thickness L/S 35um Ultra Thin Pcb 0.1mm 0.4mm Thickness L/S 35um Ultra Thin Pcb 0.1mm 0.4mm Thickness L/S 35um Ultra Thin Pcb
Basic Information
Place of Origin: china
Brand Name: Horexs
Certification: UL
Minimum Order Quantity: 1 square meter
Price: US 0.11-0.13 each piece
Packaging Details: carton customized
Delivery Time: 7-10 working days
Payment Terms: L/C, D/P, T/T, Western Union, MoneyGram
Supply Ability: 30000 square meters per month
Get Best Price Contact Now Chat Now
  • Detail Information
  • Product Description
Base Material: Ultrathin Pcb Thickness: 0.2mm
Surface Treatment: Plating Gold Hole Size: Minimun 0.1mm
Copper Thickness: 1/2OZ Solder Mask: Black
High Light:

50um Line Space Ultra Thin Pcb

,

0.4mm Ultra Thin Pcb

,

0.1mm Ultra Thin Pcb

Thickness 0.1-0.4mm Ultralthin PCB With Minimum 25um Line Width And 50um Line Space

 

Application:writing pad/touch pad,consumer electronics,Smart electronics;

Mini.Line space/width:1mil (25um)

Spec.of pcb production:

FR4 (0.15mm) finished thickness;

FR4 brand:SHENGYI or customize;

Surface finished:immersion gold;

Copper:0.5oz or Customize;

Soldermask:Green or Customize

 

HOREXS-Hubei is belong to HOREXS Group, is one of the leading and fast-growing Chinese IC substrate manufacturer.Which was located in Huangshi city of Hubei province China. Factory-Hubei is more than 60000 square meters floor space, which invested more than 300 million USD. IC Substrate Capacity 600,000SQM/Year,Tenting&SAP process. HOREXS-Hubei is committed to the development of IC substrate in China, striving to become one of the top three IC substrate manufacturers in China, and striving to become a world-class IC board manufacturer in the world . Technology like L/S 20/20un,10/10um.BT+ABF materials. Support: Wire bonding Substrate Wire bonding(BGA) Substrate Embedded (Memor y IC substrate) MEMS/CMOS,Module(RF,Wireless ,Bluetooth) 2/4/6L (1+2+1/2+2+2/1+4+1),Buildup(Buried/Blind hole) Flipchip CSP; Others ultra ic package substrate.

 

When you send inquiry us,Pls be know that we have to get the following :

1-PCB production sepc. information;

2-Gerber files(PCB designer/engineer can export it from your layout software,also send us drilling file)

3-Quantity request,Including sample;

 

Finally,If you are very big customers,Pls also let's know the details of your demand,Horexs also can support your technical supporting if you need!

HOREXS 's mission is that help you save cost with same high quality guarantee!(Better price,Better quality).



 

Tag:

Gold Plating Ultrathin Rigid PCB,

0.2mm Ultrathin Rigid PCB,

Customized Ultrathin Rigid PCB

Contact Details
Aken

Phone Number : +8613825288578

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