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China BGA Substrate manufacturer

HOREXS GROUP

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Home / Products / Sip Package Substrate

Anylayer/Buildup types Sip packaging Substrate manufacture

Anylayer/Buildup types Sip packaging Substrate manufacture
Anylayer/Buildup types Sip packaging Substrate manufacture Anylayer/Buildup types Sip packaging Substrate manufacture Anylayer/Buildup types Sip packaging Substrate manufacture
Basic Information
Place of Origin: china
Brand Name: Horexs
Certification: UL
Minimum Order Quantity: 1 square meter
Price: US 120-150 per square meter
Packaging Details: carton customized
Delivery Time: 7-10 working days
Payment Terms: L/C, D/P, T/T, Western Union, MoneyGram
Supply Ability: 30000 square meters per month
Get Best Price Contact Now Chat Now
  • Detail Information
  • Product Description
Layers: 4L Material: BT
SR: Taiyo Color: Black
Thickness: 0.24mm
High Light:

Horexs PCB

,

Gold Plated RAM PCB

,

0.8mm RAM PCB Board

Application:Wearable electronics/Memory/DSP/ASIC/CPU/IoT industry;

Anylayer/Buildup types Sip packaging Substrate manufacture 0

Spec.of Substrate production:

Mini.Line space/width:1mil (25um)

Finished thickness:0.24mm;

Material brand:Mainly brand:SHENGYI,Mitsubishi(BT),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others;

Surface finished:Mainly immersion gold,support customize such as OSP/Immersion silver,tin,more;

Copper:0.5oz or Customize;

Layer:1-6 layer (Customize);

Soldermask:Green or Customize (Brand:Soldermask:TAIYO INK,ABQ)

 

Short introduction of Horexs Manufacturer:

HOREXS-Hubei is belong to HOREXS Group, is one of the leading and fast-growing Chinese IC substrate manufacturer.Which was located in Huangshi city of Hubei province China. Factory-Hubei is more than 60000 square meters floor space, which invested more than 300 million USD. IC Substrate Capacity 600,000SQM/Year,Tenting&SAP process. HOREXS-Hubei is committed to the development of IC substrate in China, striving to become one of the top three IC substrate manufacturers in China, and striving to become a world-class IC board manufacturer in the world . Technology like L/S 20/20un,10/10um.BT+ABF materials. Support: Wire bonding Substrate Wire bonding(BGA) Substrate Embedded (Memor y IC substrate) MEMS/CMOS,Module(RF,Wireless ,Bluetooth) 2/4/6L (1+2+1/2+2+2/1+4+1),Buildup(Buried/Blind hole) Flipchip CSP; Others ultra ic package substrate.

 

When you send inquiry us,Pls be know that we have to get the following :

1-Substrate production sepc. information;

2-Gerber files(Substrate designer/engineer can export it from your layout software,also send us drilling file)

3-Quantity request,Including sample;

4-Multilayer substrate,please also provide us layer stack-up/Buildup information;

 

Finally,If you are very big customers,Pls also let's know the details of your demand,Horexs also can support your technical supporting if you need!HOREXS 's mission is that help you save cost with same high quality guarantee!

 

Want Better price,Better quality Substrate? Contact Horexs now!

 

Shipping supporting:

DHL/UPS/Fedex;

By air;

Customize express(DHL/UPS/Fedex)

Tag:

0.8mm RAM PCB Board,

Gold Plated RAM PCB,

Horexs PCB

Contact Details
Aken

Phone Number : +8613825288578

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Tianyue building 711,518100 shajing centre bao'an district Shenzhen city
86-0752-6166099 markliu@hrxpcb.cn
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