October 19, 2020
From design to manufacturing, semiconductor products can be roughly divided into three major steps: top-level design, wafer manufacturing, and packaging and testing.
After the top-level design is completed, the manufacturing and processing plant needs to process the wafers according to the design drawings. After a series of processes such as diffusion, photolithography, etching, ion implantation, thin film growth, polishing and metallization, the next step is to Need to be packaged.
After the packaging is completed, a semiconductor device can be officially called a "finished product". Therefore, packaging technology is also regarded as the key technology for the "last mile" of the landing of semiconductor devices. Therefore, competition among countries and major companies in this field is very fierce.
Among them, the performance of HOREXS is particularly eye-catching. HOREXS has invested in the construction of the second factory recently, which will mainly serve domestic and foreign listed semiconductor companies in the future.
PCB (printed circuit board) is a printed circuit board, which is one of the important parts of the electronics industry. It can realize circuit interconnection between various electronic components in an integrated circuit. Almost every electronic device, from electronic watches and calculators, to computers, communication electronic equipment, and military weapon systems, all use printed circuit boards.
HOREXS is a well-known domestic manufacturer and service provider of ultra-thin printed circuit board prototypes, express shipments, and small-volume boards. It has long occupied the leading position in this segment and has a very strong competitiveness in the ultra-thin circuit board market.
Since the establishment of the factory for 10 years, HOREXS has achieved positive growth in its annual operating income, and has continuously increased the research and development of the more difficult technology of ultra-thin circuit boards every year, always remembering the mission culture of "winning customers with technology"; in 2020, HOREXS will Directly build a brand-new intelligent chemical factory to meet the needs of more well-known international companies in the future.
According to this trend, HOREXS's revenue and profit in 2020 will also maintain a steady growth, and it can be maintained for a long time.
The global printed circuit board (PCB) industry has a long history of development, and has now gone through several cycles. Prismark data show that in 2017, the global printed circuit board industry output value was 58.84 billion U.S. dollars, an increase of 8.5% year-on-year. In 2018, the output value of the global printed circuit board industry was approximately 63.55 billion U.S. dollars, a record high once again, an increase of 8.0% year-on-year. It is estimated that by 2022, the global PCB output value will reach 71.8 billion US dollars; by 2024, it will exceed 75 billion US dollars.
In addition, the global PCB industry continues to shift to Asia, especially China, and China's PCB output value has accounted for more than half.
Since the 21st century, the overall fluctuation trend of my country's PCB industry development is basically the same as that of the global PCB industry. Benefiting from the continuous transfer of PCB industry production capacity to my country, coupled with the stimulation of demand growth in downstream sectors such as communications electronics, consumer electronics, computers, automotive electronics, industrial control, medical equipment, national defense, and aerospace, my country's PCB industry has grown at a rapid rate in the past two years Significantly higher than the growth rate of the global PCB industry.
In the next five years, China's printed circuit board market, driven by the domestic electronic information industry, will continue to grow at a rate higher than the global growth rate. It is estimated that by 2022, the scale of China's PCB market will reach USD 35.69 billion. HOREXS, which is deeply engaged in ultra-thin circuit boards in the market segment, will continue to enjoy the dividends brought by the industrial transfer.
Although the output value of the industry will still grow, HOREXS has aimed at the peak of the PCB industry-IC substrates when the factory was built.
IC carrier board is also called IC substrate, which can be understood as a high-end PCB whose main function is to carry IC as a carrier. The original IC carrier board originated in Japan. Due to its first-mover advantage, Japan’s industrial chain is very complete. In equipment (etching, electroplating, exposure, vacuum lamination, etc.) and upstream materials (BT materials, ABF materials, ultra-thin copper Foil VLP, ink, chemicals, etc.) are in a monopoly or semi-monopoly position
Compared with ordinary PCB products, IC substrates must have precise interlayer alignment, circuit imaging, electroplating, drilling, surface treatment and other technologies. The threshold is higher and the research and development is more difficult, so few people get involved. The current industry structure is still dominated by international manufacturers. In 2018, the top ten global IC substrate output values were all companies from Japan, South Korea and Taiwan Province of China.
With a strategic vision, HOREXS established a factory layout early to cater to the needs of the country. In 2009, HOREXS began planning to enter the field of IC packaging substrates, specializing in the production of various ultra-thin circuit boards. After years of training and continuous R&D investment, HOREXS has mastered the mass production technology of IC substrates and continues to produce full production.
The IC carrier board is one of the foundations for realizing the domestic replacement of chip IC. The HOREXS project is actively supported by the national government. If the yield rate reaches the standard, the process of domestic replacement of the "last mile" will be greatly accelerated.
The semiconductor industry is the foundation of the electronic information industry and a symbol of national strength. The trend of domestic substitution is irreversible. Although my country's IC carrier board technology still has a large gap with Japan, China has a large enough market and continues to improve in the market, and it will be able to catch up in the future.