November 18, 2020
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Packaging is an essential part of semiconductor manufacturing and design. It affects power, performance, and cost on a macro level, and the basic functionality of all chips on a micro level.
The package is the container that holds the semiconductor die. The packaging may be done by a separate vendor, the OSAT, although foundries are expanding their packaging efforts. The package protects the die, connects the chip to a board or other chips, and may dissipate heat.
Many types of packages in use today, and more are either in research at universities or ready for production — everything from complex stacked die with through-silicon via to fan-outs and complex systems on chip. Packages come in different materials, can be standard or custom, and they can have active or passive cooling.
Packages used to be considered a fairly non-critical part of the semiconductor design. They are now essential on every level, and there is a race on between foundries and OSATs to grab a larger share of this market as complexity and profitability increases.
Fig. 1: Key trends in packaging Source: KLA
Fig. 2: Timeline of different packaging technologies. Source: Cadence
Fig. 3: A small sample of different packaging options. Source: Cadence（article was take from Internet）