November 5, 2020
IC substrate pcb Introduction
IC card packaging framework refers to a key specialized basic material used for packaging integrated circuit card modules. It mainly protects the chip and ACTS as the interface between the IC chip and the outside world. Its form is ribbon, usually golden yellow.The use of specific process is as follows: first of all, through the automatic placement machine will integrated circuit card chip is stuck in the IC packaging framework, and then use the upper integrated circuit chips, wire welding machine contact and IC encapsulation frame connected to realize the above node circuit of unicom, finally using encapsulation materials to guard the IC chip to form integrated circuit card module, facilitate after application.IC card packaging framework supply is dependent on imports.
According to the use and form of IC card packaging framework can be divided into 6PIN, 8PIN, dual interface and contactless packaging framework, all of these are strictly in accordance with the international Standards Organization (ISO) and the International Electrotechnical Commission (IEC) standards to facilitate the automation of the back-end production process.However, the surface pattern of IC card packaging frame can be customized according to specific requirements.
According to the material of IC card packaging frame, it can be divided into metal IC card packaging frame and epoxy IC card packaging frame.The metal IC card package frame is mainly used for the package of non-contact IC card module, while the package of contact IC card module mainly USES epoxy substrate IC card package frame.
The manufacturing process of IC card packaging frame is a complicated process with high precision. It is produced by Shandong Henghui Electronics in China, which fills the domestic gap.The basic materials used in the production process are mainly imported.Specific production process is as follows: first, high-speed precision punch on glass fiber base material is used in accordance with the requirements of the design out of the corresponding space, and then through the precise lamination equipment will be conductive material bonding together, using photographic techniques to design good exposure pattern on the surface, then through the corresponding covering.they finally form the finished product.
Part of Horexs thin FR4 PCB use for eMMC,Storage designing/Testing,BGA,DDR,UFS,eMCP,UDP as following shows: