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SiP system in package (System in Package), advanced package HDAP (High Density Advanced Package), both of which are the hot spots of today's chip packaging technology, are highly concerned by the entire semiconductor industry chain. So, what are the similarities and differences between the two?

Some people say that SiP includes advanced packaging, others say that advanced packaging includes SiP, and some even say that SiP and advanced packaging mean the same thing.

Here, we first clarify that SiP≠advanced package HDAP. There are three main differences between the two: 1) different concerns, 2) different technical categories, and 3) different user groups.

In addition to these three differences, SiP and HDAP also have many similarities. The two have a large overlap in technical scope. Some technologies belong to both SiP and advanced packaging.

1) Different concerns

The focus of SiP is: the realization of the system in the package, so the system is its focus, and the corresponding SiP system-in-package is a single-chip package;

The focus of advanced packaging lies in the advancement of packaging technology and processes, so the advanced nature is its focus, and advanced packaging corresponds to traditional packaging.

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SiP is a system-in-package, so SiP needs to package more than two bare chips together. For example, baseband chip + RF chip are packaged together to form SiP. Single chip package cannot be called SiP.

Advanced packaging HDAP is different, it can include single-chip packaging, such as FOWLP (Fan Out Wafter Level Package), FIWLP (Fan In Wafter Level Package).

Advanced packaging emphasizes the advanced nature of packaging technology and processes. Therefore, packaging using traditional processes such as Bond Wire does not belong to advanced packaging.

In addition, some packaging technologies belong to both SiP and HDAP. The following figure shows the SiP technology adopted by i watch. Because of its advanced packaging technology and process, it can also be called advanced packaging technology.

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2) Different technical categories

Referring to the figure below, the technical category of advanced packaging is represented by orange-red, and the technical category of SiP is represented by light green. The two overlapping parts are represented by orange-yellow. The technology in this area belongs to both SiP and HDAP.

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From the figure, we can see that Flip Chip, integrated fan-out package INFO (Integrated Fan Out), 2.5D integration, 3D integration, and Embedded technologies belong to HDAP and will also be applied to SiP;

Single-chip FIWLP, FOWLP, FOPLP (Fan Out Panel Level Package) are advanced packages, but not SiP;

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Cavity, Bond Wire, 2D integration, 2D+ integration, and 4D integration are mostly used in SiP, and are usually not classified as advanced packaging.

Of course, the above classification is not absolute, but only shows the technical category in most cases.

For example, INFO technology belongs to FOWLP, and because it integrates more than 2 chips, it can also be called SiP; FliP Chip belongs to 2D integration, but it is generally regarded as advanced packaging.

Cavity technology is commonly used in the design and manufacture of ceramic packaging substrates. Through the cavity structure, the length of the bonding wire can be shortened and its stability can be improved. It belongs to a traditional packaging technology, but it cannot be ruled out that the use of Cavity in advanced packaging for chips Embedding and embedding.