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According to Korean media reports, semiconductor packaging and testing company Winpac recently announced that it has begun to provide uMCP packaging for SK Hynix. The company expects that uMCP orders will increase by 16.5 billion won to 220 won this year, and overall sales are expected to reach 110 billion won. As we all know, uMCP encapsulates low-power memory chips LPDDR and UFS together. Winpac purchased related equipment last year and said that due to new orders for uMCP, the company's annual sales are expected to increase by 15%-20% in 2021. The financial report for the third quarter of 2020 shows that SK Hynix accounts for 77% of Winpac's sales. Therefore, representatives of Winpac sales also show the increase in SK Hynix's shipments.

HOREXS Group also invested second IC substrate factory in HuBei province ,which the China biggest memory IC manufacture base,After finished,HOREXS Group will have more huge output for IC substrate and meet more Wafer packaging companies demand.

HOREXS Group subsidiary:

Boluo HongRuiXing Electronics Co.,Ltd

HOREXS Electronic (HK) Co.,Ltd

HOREXS (HUBEI) Electronics Co.,Ltd

Welcome contact AKEN for cooperation,akenzhang@hrxpcb.cn