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For a long time, the multi-chip package (MCP) has met the demand for adding more performance and features in smaller and smaller spaces. It is natural to hope that the MCP of the memory can be expanded to include ASICs such as baseband or multimedia processors. But this will encounter difficulties in achieving it, namely high development costs and ownership/reduction costs. How to solve these problems? The concept of Package on Package (PoP) has gradually been widely accepted by the industry.

PoP (Packaging on Packaging), that is, stacked assembly, also known as stacked packaging. POP uses two or more BGA (Ball Grid Array Package) stacks to form a package. Generally, the POP stack package structure adopts the BGA solder ball structure, which integrates high-density digital or mixed-signal logic devices on the bottom of the POP package to meet the multi-pin characteristics of logic devices. As a new type of highly integrated packaging form, PoP is mainly used in modern portable electronic products such as smart phones and digital cameras, and has a wide range of functions.

MCP is to vertically stack various types of memory or non-memory chips of different sizes in a plastic package shell. It is a hybrid technology of one-level single package. This method saves PCB space on a small printed circuit board.

In terms of SIP architecture, SiP integrates a variety of functional chips, including processors, memory and other functional chips in a package, so as to achieve a basically complete function. From the perspective of terminal electronic products, SiP does not blindly pay attention to the performance/power consumption of the chip itself, but realizes the light, thin, short, multi-functional, and low power consumption of the entire terminal electronic product. Lightweight products such as mobile devices and wearable devices have emerged. Later, SiP demand became increasingly apparent.

The difference between embedded storage packaging technology SiP, SOC, MCP, PoPThe basic concept of SoC is to integrate more devices on the same die to achieve the purpose of reducing volume, enhancing performance and reducing costs. But in the mobile phone market where the project life cycle is very short and the cost requirements are very demanding, SoC solutions have great limitations. From the perspective of memory configuration, different types of memory require a lot of logic, and mastering different design rules and technologies is a very big challenge, which will affect the development time and the flexibility required by the application.

SOC and SIP

SoC and SIP are very similar, both of which integrate a system containing logic components, memory components, and even passive components into one unit. SoC is from a design point of view, which is to highly integrate the components required by the system onto a chip. SiP is based on the packaging standpoint. It is a packaging method in which different chips are side-by-side or stacked, and multiple active electronic components with different functions, optional passive devices, and other devices such as MEMS or optical devices are preferentially assembled together. , A single standard package that realizes certain functions.

From the perspective of integration, in general, SoC only integrates AP and other logic systems, while SiP integrates AP+mobileDDR, to some extent SIP=SoC+DDR, as the integration becomes higher and higher in the future, emmc It is also likely to be integrated into SiP. From the perspective of packaging development, SoC has been established as the key and development direction of future electronic product design due to the needs of electronic products in terms of volume, processing speed, or electrical characteristics. However, with the increasing cost of SoC production in recent years and frequent technical obstacles, the development of SoC is facing bottlenecks, and the development of SiP has been paid more and more attention by the industry.

The difference between embedded storage packaging technology SiP, SOC, MCP, PoP

The development path from MCP to PoP

Combo (Flash+RAM) memory products that integrate multiple Flash NOR, NAND and RAM in a single package are widely used in mobile phone applications. These single-package solutions include multi-chip packages (MCP), system-in-package (SiP) and multi-chip modules (MCM).

The need to provide more functions in smaller and smaller mobile phones is the main driving force for the development of MCP. However, the development of a solution that can enhance performance while maintaining a small size is facing daunting challenges. Not only size is a problem, but performance is also a problem. For example, when working with a baseband chipset or multimedia coprocessor in a mobile phone, MCP memory with SDRAM interface and DDR interface should be used.

PoP stacked packaging is a good way to achieve miniaturization with high integration. In stacked packaging, Package-Out-Package (PoP) is becoming more and more important to the packaging industry, especially for mobile phone applications, because this technology can be stacked High density logic unit.

Advantages of POP packaging:

1. Storage devices and logic devices can be tested or replaced separately, ensuring the yield rate;

2. Double-layer POP packaging saves the substrate area, and the larger vertical space allows more layers of packaging;

3. Dram, DdramSram, Flash, and microprocessor can be mixed and assembled along the longitudinal direction of the PCB;

4. For chips from different manufacturers, it provides design flexibility, which can be simply mixed and assembled to meet customer needs, reducing the complexity and cost of design;

5. At present, the technology can achieve the external stacking and assembly of the layer chip in the vertical direction;

6. The electrical connections of the top and bottom layer devices are stacked to achieve a faster data transmission rate and can cope with the high-speed interconnection between logic devices and storage devices.

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