January 19, 2021
TSMC (Taiwan Semiconductor Manufacturing Company) is on track with its 3nm process technology. The company is on schedule with its development and plans on beginning the risk production phase within this year.
In a conference call earlier this week, the chipmaking giant’s CEO CC Wei stated that ” Our N3 technology development is on track with good progress. We are seeing a much higher level of customer engagement for both HPC and smartphone application at N3 as compared with N5 and N7 at a similar stage.” Furthermore, the company aims on starting mass production by the second half of 2022, with the risk production starting in the second half of this year.
According to a DigiTimes report, TSMC has also set its Capex target at 25 to 28 billion US Dollars, which is higher than the previously estimated 20 to 22 billion US Dollars. The reason for the hike is currently unknown as the company’s CEO refrained from commenting on specific orders and customers when asked about receiving outsourcing demand from Intel. However, Wei added that TSMC’s Capex intensity is high due to technical complexity.