Leave a Message

We will call you back soon!

HongRuiXing (Hubei) Electronics Co.,Ltd. Your message must be between 20-3,000 characters!

HongRuiXing (Hubei) Electronics Co.,Ltd. Please check your E-mail!

SUBMIT

More information facilitates better communication.

Mr.
  • Mr.
  • Mrs.
OK

Submitted successfully!

We will call you back soon!

OK

Leave a Message

We will call you back soon!

HongRuiXing (Hubei) Electronics Co.,Ltd. Your message must be between 20-3,000 characters!

HongRuiXing (Hubei) Electronics Co.,Ltd. Please check your E-mail!

SUBMIT
Please leave your correct email and detailed requirements.
OK
China BGA Substrate manufacturer

HOREXS GROUP

English
  • English
  • French
  • German
  • Italian
  • Russian
  • Spanish
  • Portuguese
  • Dutch
  • Greek
  • Japanese
  • Korean
  • Arabic
  • Hindi
  • Turkish
  • Indonesian
  • Vietnamese
  • Thai
  • Bengali
  • Persian
  • Polish
Request A Quote
  • Home
  • Products
    • BGA Substrate
    • IC Package Substrate
    • Sip Package Substrate
    • FCCSP Package Substrate
    • Sensors Substrate
    • RF Module Substrate
    • Memory Substrate
    • MEMS Substrate
    • IoT Substrate
    • Other Ultrathin Substrate
    • Ultrathin Rigid PCB
    • Medical Equipment PCB
  • About Us
  • Factory Tour
  • Quality Control
  • Contact Us
  • News
Products
Home / Products / IC Package Substrate

Soft Gold MCP / CSP Package Substrate BT FR4 0.1 - 0.4mm Finished Thickness

Soft Gold MCP / CSP Package Substrate BT FR4 0.1 - 0.4mm Finished Thickness
Soft Gold MCP / CSP Package Substrate BT FR4 0.1 - 0.4mm Finished Thickness Soft Gold MCP / CSP Package Substrate BT FR4 0.1 - 0.4mm Finished Thickness Soft Gold MCP / CSP Package Substrate BT FR4 0.1 - 0.4mm Finished Thickness
Basic Information
Place of Origin: CHINA
Brand Name: Horexs
Certification: UL
Minimum Order Quantity: 1 square meter
Price: US 120-150 per square meter
Packaging Details: carton customized
Delivery Time: 7-10 working days
Payment Terms: Western Union, MoneyGram, T/T, L/C
Supply Ability: 30000 square meters per month
Get Best Price Contact Now Chat Now
  • Detail Information
  • Product Description
Package: CSP/MCP Finished: Soft Gold
Core: 40um,39um L/S: 35/35um(MP)
Copper: 0.5oz Or Customize
High Light:

Soft Gold CSP Package Substrate

,

CSP Package Substrate 0.4mm

,

BT MCP Package Substrate

Soft gold MCP/CSP package substrate manufacture supporting

MCP (Multi-Chip Package)
MCP is the structure that increases memory capacity and performance, and maximizes the foot print efficiency by stacking several thin Chip vertically on the thin substrate with previous CSP mounting technology.
CSP (Chip Size Package)
CSP is to attach Chip to the laminated substrate with wire-bonding and encapsulate it by using plastic-type molding compound , placing solderball pad partly or entirely in lattice-shaped on the opposite side of it. Chip and package have the nearly same size.
It can be applied to apparatus with the small footprint and fast speed in terms of package size and design.

 

Application:

  1. Semi Package
  2. Semiconductors
  3. Semiconductor
  4. IC package
  5. IC substrate
  6. Smart phone
  7. Tablet, IoT devices
  8. Infotainment system
  9. Notebook PC, etc.

 

Spec.of pcb production:

Mini.Line space/width:1mil (35um)

Finished thickness:BT/FR4 (0.1-0.4mm) finished thickness;

Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others;

Surface finished:Mainly immersion gold,support customize such as OSP/Immersion silver,tin,more;

Copper:0.5oz or Customize;

Layer:1-6 layer (Customize);

Soldermask:Green or Customize (Brand:Soldermask:TAIYO INK,ABQ)

Soft Gold MCP / CSP Package Substrate BT FR4 0.1 - 0.4mm Finished Thickness 0

 

Short introduction of Horexs Manufacturer:

HOREXS is whole process ultra thin FR4 PCB manufacturer in CHINA,It's also one of the famous thin FR4 PCB (IC Susbtrate ) manufacturers in CHINA,which has AVI,AOI for checking,3 LDI for soldermask and circuit line,Mekki brand laminate press machines,Quality yield more than 99.7%,quite Stable quality guaratnee! Welcome to visit us to check it too!

 

Horexs's Products are widely used in IC assembly/IC substrate package, smart card, IC card, Micro SD,Sensor package, eMMC,BGA,UFS,eMCP,uMCP,DDR4,MEMS, small TF card, SD card, SIM card, high voltage circuit breaker, a tablet computer, electronic antenna, tag, microphone, 3D optical technique.

 

 

When you send inquiry us,Pls be know that we have to get the following :

1-PCB production sepc. information;

2-Gerber files(PCB designer/engineer can export it from your layout software,also send us drilling file)

3-Quantity request,Including sample;

4-For multilayer thin FR4 PCB,please also provide us layer stack-up information;

 

Finally,If you are very big customers,Pls also let's know the details of your demand,Horexs also can support your technical supporting if you need!HOREXS 's mission is that help you save cost with same high quality guarantee!

 

Want Better price,Better quality pcb ? Contact Horexs now!

 

Shipping supporting:

DHL/UPS/Fedex;

By air;

Customize express(DHL/UPS/Fedex)

Tag:

Ultra Thin Bga Circuit Board,

Horexs Bga Circuit Board,

Bga Circuit Board With Wire Bonding

Contact Details
Mark Liu

Phone Number : 13927393064

More IC Package Substrate
  • Storage IC Package Substrate Pcb
    Show Details

    Storage IC Package Substrate Pcb

    Contact Now
  • Hitachi brand BT material substrate manufacture
    Show Details

    Hitachi brand BT material substrate manufacture

    Contact Now
  • Hitachi BT IC Package Substrate production supporting
    Show Details

    Hitachi BT IC Package Substrate production supporting

    Contact Now
  • 0.15mm IC assembly package substrate For semiconductor package
    Show Details

    0.15mm IC assembly package substrate For semiconductor package

    Contact Now
Categories
  • BGA Substrate
  • IC Package Substrate
  • Sip Package Substrate
  • FCCSP Package Substrate
Factory Tour
  • Production Line
  • OEM/ODM
  • R&D
About Us
  • Introduction
  • History
  • Service
  • Our Team
Contact Us
HongRuiXing (Hubei) Electronics Co.,Ltd.
Tianyue building 711,518100 shajing centre bao'an district Shenzhen city
86-0752-6166099 markliu@hrxpcb.cn
  • Privacy Policy
  • Sitemap
  • Mobile Site
China Good Quality BGA Substrate Supplier. © 2020 - 2023 horexspcb.com. All Rights Reserved.