BOC (Board on Chip)
BOC is the substrate that connects bonding pad on substrate to the bonding pad of chip by using wire-bonding through the central slot.
It has the bonding and solder side of the substrate in one plane. It replaced the previous lead frame into laminated substrate, which enables I/O pins to diversify and chip to stack vertically, thus it is widely used in memory chip as it is easy to achieve high speed & high density.
IC substrate is a type of carry material for integrated circuit with internal circuit to connect the chips and PCBS. Additionally,
the IC substrate can protect the circuit, special line, it is designed for heat dissipation and acts standardized module of IC
components. It is one of the most key materials of the IC packaging, and the share of IC substrate.
Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others;
Surface finished:Mainly immersion gold,support customize such as OSP/Immersion silver,tin,more;
Copper:0.5oz or Customize;
Layer:1-6 layer (Customize);
Soldermask:Green or Customize (Brand:Soldermask:TAIYO INK,ABQ)
Short introduction of Horexs Manufacturer:
HOREXS is whole process ultra thin FR4 PCB manufacturer in CHINA,It's also one of the famous thin FR4 PCB (IC Susbtrate ) manufacturers in CHINA,which has AVI,AOI for checking,3 LDI for soldermask and circuit line,Mekki brand laminate press machines,Quality yield more than 99.7%,quite Stable quality guaratnee! Welcome to visit us to check it too!
Almost of Horexs production machines are from Japan,high precision for production,It's also the reason of stable quality guarantee!
Welcome contact Horexs to produce your design/your idea/your pcb boards ,your layout desing.
Horexs's Products are widely used in IC assembly/IC substrate package, smart card, IC card, Micro SD,Sensor package, eMMC,BGA,UFS,eMCP,uMCP,DDR4,MEMS, small TF card, SD card, SIM card, high voltage circuit breaker, a tablet computer, electronic antenna, tag, microphone, 3D optical technique.
When you send inquiry us,Pls be know that we have to get the following :
1-PCB production sepc. information;
2-Gerber files(PCB designer/engineer can export it from your layout software,also send us drilling file)
3-Quantity request,Including sample;
4-For multilayer thin FR4 PCB,please also provide us layer stack-up information;
Finally,If you are very big customers,Pls also let's know the details of your demand,Horexs also can support your technical supporting if you need!HOREXS 's mission is that help you save cost with same high quality guarantee!
• Fine pattern by MSAP(20/20um) and Tenting(30/30um) • Various Applicable Technical Option - Thin Core Technology - All type Surface Finish - SR Flatness Process, Build up / Via Filling Tech. - Tailless, Etch-back Process - Fine Pitch SOP process • High Quality and Reliability Substrate • High Speed Delivery : No need film, No outsourcing • Competitive Low Running Cost