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China BGA Substrate manufacturer

HOREXS GROUP

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Home / Products / IC Package Substrate

EMMC IC Package Substrate PCB BGA Gold Plating 0.2mm Finished FR4 Material

EMMC IC Package Substrate PCB BGA Gold Plating 0.2mm Finished FR4 Material
EMMC IC Package Substrate PCB BGA Gold Plating 0.2mm Finished FR4 Material EMMC IC Package Substrate PCB BGA Gold Plating 0.2mm Finished FR4 Material EMMC IC Package Substrate PCB BGA Gold Plating 0.2mm Finished FR4 Material
Basic Information
Place of Origin: CHINA
Brand Name: Horexs
Certification: UL
Minimum Order Quantity: 1 square meter
Price: US 120-150 per square meter
Packaging Details: carton customized
Delivery Time: 7-10 working days
Payment Terms: Western Union, MoneyGram, T/T, L/C
Supply Ability: 8000 square meters per month
Get Best Price Contact Now Chat Now
  • Detail Information
  • Product Description
Application: TGA Or Thermal Analysis Type: Ceramic Parts
Material: Alumina Ceramic Size: Size Customized
Name: IC Package Substrate Finished Thickness: FR4
High Light:

EMMC IC Package Substrate

,

Gold Plating IC Package Substrate

,

0.2mm Package Substrate PCB

eMMC IC package substrate pcb

 

For eMMC IC assembly package substrate pcb, BGA ,Gold plating,0.2mm finished,FR4 material,green soldermask (support customized),Use for wearable electronics,UAV,house electronics,consumer electronics.

 

Product description

IC substrate is a type of carry material for integrated circuit with internal circuit to connect the chips and PCBS. Additionally,
the IC substrate can protect the circuit, special line, it is designed for heat dissipation and acts standardized module of IC
components. It is one of the most key materials of the IC packaging, and the share of IC substrate.

 

 

Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,EMMC substrate,IC assembly,Storage IC substrage;

Spec.of pcb production:

Mini.Line space/width:1mil (25um)

Finished thickness:FR4 (0.1-0.4mm) finished thickness;

Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others;

Surface finished:Mainly immersion gold,support customize such as OSP/Immersion silver,tin,more;

Copper:0.5oz or Customize;

Layer:1-6 layer (Customize);

Soldermask:Green or Customize (Brand:Soldermask:TAIYO INK,ABQ)

 

Short introduction of Horexs Manufacturer:

HOREXS is whole process ultra thin FR4 PCB manufacturer in CHINA,It's also one of the famous thin FR4 PCB (IC Susbtrate ) manufacturers in CHINA,which has AVI,AOI for checking,3 LDI for soldermask and circuit line,Mekki brand laminate press machines,Quality yield more than 99.7%,quite Stable quality guaratnee! Welcome to visit us to check it too!

Almost of Horexs production machines are from Japan,high precision for production,It's also the reason of stable quality guarantee!

Welcome contact Horexs to produce your design/your idea/your pcb boards ,your layout desing.

 

 

When you send inquiry us,Pls be know that we have to get the following :

1-PCB production sepc. information;

2-Gerber files(PCB designer/engineer can export it from your layout software,also send us drilling file)

3-Quantity request,Including sample;

4-For multilayer thin FR4 PCB,please also provide us layer stack-up information;

 

Finally,If you are very big customers,Pls also let's know the details of your demand,Horexs also can support your technical supporting if you need!HOREXS 's mission is that help you save cost with same high quality guarantee!

 

Want Better price,Better quality pcb ? Contact Horexs now!

 

Shipping supporting:

DHL/UPS/Fedex;

By air;

Customize express(DHL/UPS/Fedex)

Tag:

Ultra Thin Bga Circuit Board,

Horexs Bga Circuit Board,

Bga Circuit Board With Wire Bonding

Contact Details
Mark Liu

Phone Number : 13927393064

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