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HOREXS helps promote the upgrading of glass substrate industry
Munich Electronic fair C6-220/9
uHDI PCB knowledge and development
uHDI PCB capability in HOREXS
HOREXS will attend the Semicon Eurpa 2024
FCBGA (ABF) Substrate
HOREXS will start FCBGA(ABF) R&D in July
HOREXS attend Malaysia EMAX-Electronics Manufacturing exhibition
CNY holiday end,2nd factory running
Visit & explore HOREXS IC substrate manufacturing plant
HOREXS new plant (package substrate) factory was put into production
HOREXS facility
HOREXS declaration
IC Substrate Technology Overview
HOREXS support SIP(System in package) substrate manufacture
HOREXS support FBGA package substrate production
Packaging substrates are in the golden track, and multiple factors accelerate domestic expansion
ABF material substrate in short supply
The NAND memory industry landscape is undergoing a major reorganization
Evolution of CMOS Image Sensor Architectures
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Products
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BGA Substrate
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IC Package Substrate
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Sip Package Substrate
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FCCSP Package Substrate
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Sensors Substrate
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RF Module Substrate
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Memory Substrate
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MEMS Substrate
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IoT Substrate
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Other Ultrathin Substrate
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Ultrathin Rigid PCB
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Medical Equipment PCB
(1)
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