English
中文
English
French
German
Italian
Russian
Spanish
Portuguese
Dutch
Greek
Japanese
Korean
Arabic
Hindi
Turkish
Indonesian
Vietnamese
Thai
Bengali
Persian
Polish
Home
Products
BGA Substrate
IC Package Substrate
Sip Package Substrate
FCCSP Package Substrate
Sensors Substrate
RF Module Substrate
Memory Substrate
MEMS Substrate
IoT Substrate
Other Ultrathin Substrate
Ultrathin Rigid PCB
Medical Equipment PCB
About Us
Factory Tour
Quality Control
Contact Us
News
FCBGA (ABF) Substrate
HOREXS will start FCBGA(ABF) R&D in July
HOREXS attend Malaysia EMAX-Electronics Manufacturing exhibition
CNY holiday end,2nd factory running
Visit & explore HOREXS IC substrate manufacturing plant
HOREXS new plant (package substrate) factory was put into production
HOREXS facility
HOREXS declaration
IC Substrate Technology Overview
HOREXS support SIP(System in package) substrate manufacture
HOREXS support FBGA package substrate production
Packaging substrates are in the golden track, and multiple factors accelerate domestic expansion
ABF material substrate in short supply
The NAND memory industry landscape is undergoing a major reorganization
Evolution of CMOS Image Sensor Architectures
TSMC advanced packaging, the latest progress
U.S. sanctions, Russian semiconductors plummet by 90%
HOREXS supporting Substrate types
Speed up IC Substrate manufacture,HOREXS 2nd plant running in July
How will DRAM shrink?
Request A Quote
Products
(132)
BGA Substrate
(25)
IC Package Substrate
(46)
Sip Package Substrate
(2)
FCCSP Package Substrate
(7)
Sensors Substrate
(3)
RF Module Substrate
(2)
Memory Substrate
(19)
MEMS Substrate
(3)
IoT Substrate
(3)
Other Ultrathin Substrate
(8)
Ultrathin Rigid PCB
(13)
Medical Equipment PCB
(1)
About Us
Factory Tour
Quality Control
Contact Us
news
Cases
Request A Quote
Contact Us
Contact Person :
Mark Liu
Phone Number :
13927393064
Free call
Home
All Cases
Company Cases
markliu@hrxpcb.cn
lc3847
13927393064
