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CNY holiday end,2nd factory running
Visit & explore HOREXS IC substrate manufacturing plant
HOREXS new plant (package substrate) factory was put into production
HOREXS facility
HOREXS declaration
IC Substrate Technology Overview
HOREXS support SIP(System in package) substrate manufacture
HOREXS support FBGA package substrate production
Packaging substrates are in the golden track, and multiple factors accelerate domestic expansion
ABF material substrate in short supply
The NAND memory industry landscape is undergoing a major reorganization
Evolution of CMOS Image Sensor Architectures
TSMC advanced packaging, the latest progress
U.S. sanctions, Russian semiconductors plummet by 90%
HOREXS supporting Substrate types
Speed up IC Substrate manufacture,HOREXS 2nd plant running in July
How will DRAM shrink?
How will DRAM shrink?
The UK should also vigorously develop local semiconductors?
Production capacity for packaging and testing is tight, OSAT sweeps machines to prepare for battle
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